The Die-to-Die (D2D) Interconnect from SkyeChip is a finely-tuned solution engineered to knit together multiple dies in sophisticated electronic systems. Leveraging efficient die-to-die technology, this interconnect supports cutting-edge 2.5D and 3D packaging methods and protocols such as PCIe and CXL, thus catering to diverse communication frameworks across die setups.
SkyeChip's D2D Interconnect is designed to foster high-speed communication, supporting data transfers up to 32 Gbps per pin, effectively meeting the demands of high-bandwidth applications. Its lightweight architecture minimizes area and power consumption, contributing to the creation of compact and energy-efficient devices. The solution also incorporates test and repair functionalities to maximize post-packaging yields, cementing its role in high-reliability device manufacturing.
