Metis is an advanced EM solver that provides large-capacity simulation capabilities for 2.5D and 3D IC packaging. It enables comprehensive signal integrity (SI) and power integrity (PI) analysis, essential for modern multi-die package designs.
This sophisticated tool aids in the simulation of complex IC designs, allowing designers to evaluate the interaction between different dielectrics and conductors within a multi-die package environment. Metis facilitates accurate modeling and optimization of electrical characteristics, ensuring designs are both reliable and high-performing.
Engineers can leverage Metis to tackle the challenges of noise, cross-talk, and electromagnetic interference within dense packaging environments. Its ability to support detailed simulations helps in pushing the envelope of what is achievable in IC packaging, making it crucial for industries adopting advanced semiconductor technologies.
