The NuLink Die-to-Memory (D2M) PHY products from Eliyan provide a robust solution for memory-intensive applications, offering high bandwidth and low power consumption. This technology stands out by providing a dynamic communication link devoid of the constraints of fixed unidirectional die-to-die architectures. Utilizing a bidirectional approach, it supports greater efficiency and performance. D2M PHY products are pivotal in scenarios where a substantial separation is necessary between heat-sensitive memory and high-power ASICs, optimizing thermal management and power distribution across the package. The bidirectional design enhances flexibility and scalability, allowing seamless adaptation to different die configurations required for evolving technological demands.
