XtremeSilica's UCIe (Universal Chiplet Interconnect Express) is crafted for high-bandwidth interconnectivity between chiplets in advanced semiconductor nodes. This solution facilitates scaling in integrated circuits by enabling modular designs that enhance versatility and performance. UCIe is pivotal for manufacturing complex SoCs (System-on-Chips) where diverse functionality is required. Its architecture supports a powerful ecosystem for chiplet integration, optimizing energy efficiency and enabling advancements in next-gen computing architectures.
