The UCIe Chiplet Interconnect is an advanced solution facilitating unparalleled communication across chiplets, ensuring efficient system scalability and integration. This interconnect standard supports high data rates ranging from 24Gbps to 32Gbps, making it essential for cutting-edge multi-chip module (MCM) designs and System in Package (SiP) technologies. Designed with flexibility, it bridges various interfaces such as AXI and CHI, providing designers with versatile options for high-throughput interconnection across different silicon pieces.
Its architecture supports both die-to-die and chip-to-chip communications, essential for modern heterogeneous applications that require diverse functionalities within a compact system footprint. InnoSilicon’s UCIe solution promotes seamless data exchange and minimizes bottlenecks, improving the efficiency of systems relying heavily on parallel processing and large data transfers.
This technology plays a critical role in the rapid prototyping and mass production of high-performance computing systems and AI-powered devices. Supporting current and future process nodes, the UCIe Chiplet Interconnect ensures adaptability and relevance in an evolving semiconductor landscape, contributing to the growing demand for modular and customizable semiconductor infrastructure.
