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All IPs > Interface Controller & PHY > AMBA AHB / APB/ AXI > Universal Chiplet Interconnect Express (UCIe)

Universal Chiplet Interconnect Express (UCIe)

From EXTOLL GmbH

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Description

Universal Chiplet Interconnect Express, or UCIe, is a forward-looking interconnect technology that enables high-speed data exchanges between various chiplets. Developed to support a modular approach in chip design, UCIe enhances flexibility and scalability, allowing manufacturers to tailor systems to specific needs by integrating multiple functions into a single package.

The architecture of UCIe facilitates seamless data communication, crucial in achieving high-performance levels in integrated circuits. It is designed to support multiple configurations and implementations, ensuring compatibility across different designs and maximizing interoperability.

UCIe is pivotal in advancing the chiplet strategy, which is becoming increasingly important as devices require more complex and diverse functionalities. By enabling efficient and quick interchip communication, UCIe supports innovation in the semiconductor field, paving the way for the development of highly efficient and sophisticated systems.

Features
  • Modular interconnect solution
  • Supports multiple configurations
Foundries & Process Nodes
Foundry Process Nodes
GLOBALFOUNDRIES 22nm
28nm
Samsung 22nm
28nm
TSMC 22nm
28nm
UMC 22nm
28nm
Tech Specs
Applications
  • Composable IC design
  • High-performance telecommunications
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