All IPs > Interface Controller & PHY > D2D
Device-to-Device (D2D) communication is a critical component in modern electronics, enabling direct interaction between devices without intermediary network infrastructure. Within our Interface Controller & PHY category, the D2D segment offers specialized semiconductor IPs designed to streamline and enhance these direct connections. These IPs are indispensable in creating an efficient communication link that can handle the increasing data demands seen in consumer electronics, automotive systems, and IoT devices.
Our D2D semiconductor IPs consist of essential building blocks such as interface controllers and Physical Layer (PHY) IP cores. These components are engineered to facilitate seamless communication between devices, whether it be for transferring data, synchronizing functions, or sharing resources in real-time. By leveraging these IPs, manufacturers can achieve low latency, high-speed data transfer, and robust connectivity, making these components suitable for applications requiring precise and rapid interaction.
Incorporating D2D IPs into your design allows for efficient use of bandwidth and power, critical factors in battery-operated or compact devices. The versatility of these semiconductor IPs makes them a popular choice in developing smart home devices, wearables, and vehicle infotainment systems, where direct and reliable device-to-device communication is paramount. These IPs also help minimize reliance on external network structures, providing a more secure and localized network environment.
The D2D interface controller and PHY IPs in our collection are developed to cater to the demanding needs of modern technological solutions. Whether you are designing a new IoT ecosystem or enhancing an automobile's connectivity suite, selecting the right D2D IP core can significantly impact your product’s performance and user experience. Explore our offerings to find the IP solutions that best align with your innovation goals, ensuring your devices communicate effectively and efficiently.
Universal Chiplet Interconnect Express, or UCIe, is a forward-looking interconnect technology that enables high-speed data exchanges between various chiplets. Developed to support a modular approach in chip design, UCIe enhances flexibility and scalability, allowing manufacturers to tailor systems to specific needs by integrating multiple functions into a single package. The architecture of UCIe facilitates seamless data communication, crucial in achieving high-performance levels in integrated circuits. It is designed to support multiple configurations and implementations, ensuring compatibility across different designs and maximizing interoperability. UCIe is pivotal in advancing the chiplet strategy, which is becoming increasingly important as devices require more complex and diverse functionalities. By enabling efficient and quick interchip communication, UCIe supports innovation in the semiconductor field, paving the way for the development of highly efficient and sophisticated systems.
Eliyan's NuLink Die-to-Die (D2D) PHY products are designed to provide high-performance, low-power connectivity between chips, or 'chiplets,' in a system. Using standard organic laminate packaging, these IP cores maintain power and performance levels that would traditionally require advanced packaging techniques like silicon interposers. This eliminates the need for such technology, allowing cost-effective system design and reducing thermal, test, and production challenges while maintaining performance. Eliyan’s approach enables flexibility, allowing a broad substrate area that supports more chiplets in the package, significantly boosting performance and power metrics. These D2D PHY cores accommodate various industry standards, including UCIe and BoW, providing configurations tailor-made for optimal bump map layout, thus enhancing overall system efficiency.
The SERDES solutions by Analog Bits are integral components for high-speed data transfer applications, effectively serializing and deserializing data streams to improve bandwidth efficiency in electronic devices. These SERDES IPs support data rates that suit a variety of communication standards, including Ethernet and PCI Express. Leveraging state-of-the-art design techniques, these solutions optimize data throughput and reduce latency, providing the necessary data integrity and speed for applications like telecommunications and high-performance computing. Their scalable architecture allows for customization across different technology nodes, catering to specific design needs and operational environments. Analog Bits' SERDES IPs are commonly implemented in data-intensive applications, making them suitable for industries demanding high-speed connectivity, such as data centers, automotive electronics, and mobile communications. These products are validated on leading process nodes, ensuring that they deliver consistent performance even under stringent conditions.
Credo Semiconductor excels in SerDes (Serializer/Deserializer) IP for custom ASICs, providing solutions that facilitate easy integration into various System on Chip (SoC) designs. The architecture of Credo's SerDes IP is based on a mixed-signal DSP approach that enhances performance while minimizing power and integration challenges. This architecture is especially beneficial for high-bandwidth data processing scenarios, making it an ideal choice for applications in AI, high-performance computing, and advanced telecommunication infrastructures.<br /><br />Their custom-built SerDes solutions stand out for the ability to handle tens and even hundreds of lanes, thanks to their innovative approach that seamlessly bridges the gap between core and analog logic deployment. These IPs are crafted to thrive even in mature process nodes, delivering remarkable efficiency in terms of power consumption and cost-effectiveness. By implementing these IPs, companies can ensure their systems are robust, future-proof, and capable of handling substantial data transmission tasks.<br /><br />Among the notable advantages offered by Credo’s SerDes IP is their adaptability with various signaling standards such as NRZ and PAM4, facilitating diverse data rate requirements up to 112G per lane. This flexibility not only aligns with current technological trends but also positions companies to swiftly adapt to future advancements in data communication technology, leveraging Credo's partnership with leading foundries and process nodes, such as TSMC's N3 and N5 technologies.
High-Speed SerDes for Chiplets is engineered to provide exceptional interconnect solutions tailored for chiplet architectures. This product offers ultra-low power consumption while maintaining high data transfer rates, essential for modern multi-die systems. By facilitating rapid communication between chiplets, it enhances overall system efficiency and performance. This SerDes solution is optimized for integration with a range of tech nodes, ensuring compatibility with various semiconductor manufacturing processes. Its design is focused on providing robust data integrity and reducing latency, which are crucial for efficient system operation in complex, integrated circuits. High-Speed SerDes addresses the growing demand for advanced interconnect solutions in chiplet architectures, making it an indispensable tool for developing next-generation semiconductor devices. Its ability to support high data throughput while keeping power use minimal makes it a standout choice in high-performance design environments.
YouSerdes offers a versatile, high-speed serial interface solution supporting a broad range of data rates from 2.5Gbps to 32Gbps. The multi-rate SERDES solution is innovatively designed to incorporate multiple SERDES channels, delivering superior performance, minimized area, and reduced power consumption compared to other competitive products. This solution is ideal for high-speed data transfer applications, delivering reliable performance across various industry standards. Its optimized architecture ensures that designers can achieve maximum throughput, catering to the demanding needs of telecommunication, data center, and consumer electronic applications. Moreover, YouSerdes is crafted to provide a seamless integration experience, backed by comprehensive compatibility with different IC platforms. This adaptability facilitates a smoother system design process, allowing developers to integrate high-speed connectivity into their products efficiently.
MAXVY UCIe VIP , a state-of-the-art solution that offers a comprehensive set of features and capabilities to ensure the quality and performance of your UCIe designs. MAXVY UCIe VIP is fully compliant with UCIe Specification version 1.0 and supports all the layers of the UCIe stack, such as FDI, RDI, LogPHY, PCIe, and CXL protocols. MAXVY UCIe VIP is also very user-friendly and flexible, with simple APIs, easy integrations, and configurable parameters. You can easily customize and control the UCIe functionality according to your needs. MAXVY UCIe VIP also provides a rich set of verification capabilities, such as protocol checks, functional coverage, traffic generation, error injection, and debug tools. You can easily monitor, detect, and report any issues or violations in your UCIe designs. MAXVY UCIe VIP is compatible with the industry-standard Universal Verification Methodology (UVM) and supports all leading simulators. With MAXVY UCIe VIP, very flexible for unit level testing, you can achieve faster verification closure and higher quality of your UCIe designs.
The Die-to-Die (D2D) Interconnect from SkyeChip is a finely-tuned solution engineered to knit together multiple dies in sophisticated electronic systems. Leveraging efficient die-to-die technology, this interconnect supports cutting-edge 2.5D and 3D packaging methods and protocols such as PCIe and CXL, thus catering to diverse communication frameworks across die setups. SkyeChip's D2D Interconnect is designed to foster high-speed communication, supporting data transfers up to 32 Gbps per pin, effectively meeting the demands of high-bandwidth applications. Its lightweight architecture minimizes area and power consumption, contributing to the creation of compact and energy-efficient devices. The solution also incorporates test and repair functionalities to maximize post-packaging yields, cementing its role in high-reliability device manufacturing.
The BlueLynx Chiplet Interconnect system provides an advanced die-to-die connectivity solution designed to meet the demanding needs of diverse packaging configurations. This interconnect solution stands out for its compliance with recognized industry standards like UCIe and BoW, while offering unparalleled customization to fit specific applications and workloads. By enabling seamless connection to on-die buses and Networks-on-Chip (NoCs) through standards such as AMBA, AXI, ACE, and CHI, BlueLynx facilitates faster and cost-effective integration processes. The BlueLynx system is distinguished by its adaptive architecture that maximizes silicon utilization, ensuring high bandwidth along with low latency and power efficiency. Designed for scalability, the system supports a remarkable range of data rates from 2 to 40+ Gb/s, with an impressive bandwidth density of 15+ Tbps/mm. It also provides support for multiple serialization and deserialization ratios, ensuring flexibility for various packaging methods, from 2D to 3D applications. Compatible with numerous process nodes, including today’s most advanced nodes like 3nm and 4nm, BlueLynx offers a progressive pathway for chiplet designers aiming to streamline transitions from traditional SoCs to advanced chiplet architectures.
The CXL 3.0 solution from Rapid Silicon is an advanced Controller IP designed to enhance your FPGA design with superior performance and flexibility. This IP is compliant with CXL specifications up to version 3.0, along with support for earlier versions 2.0, 1.1, and 1.0. It offers seamless integration capabilities with PCIe, standing up to PCIe 6.0 and ensuring backward compatibility. The architecture of the CXL Controller IP is highly configurable, providing adaptability for specific application requirements, including lane configurations, datapath widths, and efficiency in power management. One of the standout features of the CXL 3.0 IP is its support for advanced functionalities such as lane bonding, multicast, and robust error correction mechanisms. These features ensure the IP delivers reliable and efficient performance in diverse environments. Ideal for critical data-intensive tasks, the IP is suited for telecommunications, industrial applications, and more, where data throughput and protocol bridging are crucial. With its focus on delivering unmatched speed, efficiency, and scalability, the CXL 3.0 IP from Rapid Silicon is positioned as a key component for enabling sophisticated FPGA designs tailored to meet modern technology demands. Its architecture is crafted to support the burgeoning needs of applications that require high degrees of data handling and processing accuracy, making it a preferred choice in the semiconductor industry.
Analog Bits provides robust I/O solutions that are essential for the efficient transfer of signals between semiconductor devices and their external environment. These input/output interfaces are designed to meet the most demanding performance criteria, ensuring fast data rates and minimal signal distortion. Their I/O IP solutions can accommodate a variety of protocols, including high-speed digital interfaces and analog conversions, offering versatility and support for applications such as networking, data processing, and consumer electronics. By optimizing the signal integrity and electromagnetic compatibility, these I/Os enhance the overall system performance. Equipped with advanced features for low power consumption, these I/Os contribute to reducing the overall energy footprint of semiconductor devices, making them ideal for battery-operated devices and environmentally sensitive applications. Analog Bits' I/Os are comprehensively integrated to function seamlessly within mixed-signal environments, further broadening their application range.
The JESD204B Multi-Channel PHY from Naneng Microelectronics is designed to meet the rigorous demands of high-speed data transmission. Featuring a data rate capability of up to 12.5Gbps, this physical layer multi-channel interface supports a wide array of applications requiring reliable and efficient data transfer. Its versatile architecture ensures seamless integration into complex systems, providing robust performance benefits in the field of data communications. A comprehensive design enhances usability and flexibility, allowing customization for specific industrial needs. This PHY is particularly adept in high-density environments, ensuring precision synchronization across multiple channels, critical for signal integrity in today's intricate electronic ecosystems. Furthermore, the solution's efficient layout allows for ease of interoperability with existing infrastructure, reducing integration costs and time-to-market for end-users. This makes the JESD204B Multi-Channel PHY an attractive choice for enterprises aiming for optimal performance in digital communication systems without compromising efficiency.
The UDP/IP Ethernet core by Enclustra is crafted to facilitate efficient and reliable data communication over Ethernet networks using the User Datagram Protocol (UDP). This IP core is integral for FPGA-based subsystems requiring seamless interconnectivity with other subsystems across network domains. By leveraging the simplicity and low overhead characteristics of UDP, this core ensures high-speed data transfer and is especially suited for applications where performance and simplicity are paramount, such as in embedded systems and networked control systems. It supports the transmission of data across various Ethernet configurations, thereby enhancing the flexibility and scalability of networking components. The core's implementation provides a reliable means of sending and receiving data packets across networks, making it a vital component for developers looking to create connected systems. Its integration into existing FPGA designs is straightforward, enabling quick deployment and consistent communication performance across Ethernet infrastructures.
The Chiplet Interface solutions provided by Neuron IP include cutting-edge PHY & D2D Adapter IP for chiplet products. These solutions are built around the latest UCIe v1.1 specification and are designed to support a wide range of application verticals. They are well-known for their unparalleled PPA-differentiated architecture, which includes 32Gbps UCIe-Advanced and Standard cores. These interfaces are set to revolutionize the way microprocessors work in ultra-low latency environments, enhancing both performance and efficiency.
AresCORE UCIe Die-to-Die PHY is a tailored solution for die-to-die interconnects, designed to simplify the link between chiplets within a complex system. It addresses the critical demand for reliable, high-bandwidth communication channels in multi-die packages, facilitating scalable system architectures. Capable of supporting wide bandwidth requirements, AresCORE enhances performance with minimized power consumption, essential in preventing bottlenecks in data-intensive applications. This PHY is engineered to seamlessly integrate into modern SoC designs, offering flexibility and enhanced operational efficiency. The robust architecture and comprehensive testing capabilities of AresCORE ensure data integrity and compatibility with future technological advancements. Its adaptability to various implementation scenarios makes it a suitable choice for next-generation computing technologies.
The Glasswing Ultra-Short Reach SerDes is a cutting-edge interconnect solution leveraging the unique CNRZ-5 Chord Signaling technology. It is designed to enhance high-bandwidth and low-power performance across chip-to-chip interfaces, optimizing silicon use by lowering pin count while boosting throughput. This innovative technology transmits five bits over six wires, effectively doubling bandwidth and minimizing power requirements. This solution allows the seamless creation of a chiplet ecosystem, facilitating complex connections in high-performance computing environments. Notably, Glasswing delivers significantly higher throughput per pin, alongside lower power consumption compared to traditional NRZ solutions. This feature makes it particularly valuable for applications such as AI, ML, networking, and high-performance computing, where efficiency and throughput are critical. Glasswing excels in modularity and diagnostics, offering dynamic configuration and real-time signal strength monitoring. Its capabilities allow integration into large multi-chip modules with high signal integrity, unlocking potential in fields ranging from satellite communications to consumer electronics. Furthermore, the use of substrate rather than complex silicon interposers reduces cost and complexity, making it a financially attractive option for large-scale projects.
The VITA 17.1 Serial FPDP Solution from StreamDSP is designed for high-speed data transfer applications. This solution leverages industry-standard interfaces to facilitate efficient serial data communications, ensuring seamless data flow in demanding environments. It's ideal for applications that require robust data integrity and low-latency transmission, making it a perfect fit for military and aerospace operations. By supporting a range of configurations and offering flexibility in integration, this solution helps address specific user needs while maintaining compatibility with widely used FPGA devices.
Sofics has verified its TakeCharge ESD protection clamps on technology nodes between 0.25um CMOS down to 3nm across various fabs and foundries. The ESD clamps are silicon and product proven in more than 5000 mass produced IC-products. The cells provide competitive advantage through improved yield, reduced silicon footprint and enable low-leakage, high-speed or high voltage tolerant interfaces. The ESD protection described in this document can be used for 1.6V chiplet (die-2-die) interface pads in the GF 22nm FDX technology. The ESD robustness is strongly reduced in order to reduce the size and capacitance.
Photowave optical communications hardware is expertly crafted for the emerging needs of AI memory applications requiring disaggregated resources. Specifically engineered to be compatible with PCIe 5.0/6.0 and CXL 2.0/3.0, Photowave capitalizes on photonics to provide superior latency and energy efficiency. This technology is a game-changer for data centers, offering managers the ability to scale resources flexibly either within individual racks or across multiple server racks, paving the way for more adaptive and powerful data management solutions. By embracing the fundamental strengths of photonics, Photowave empowers large-scale computing systems to achieve previously unattainable levels of efficiency and responsiveness. This optical communication solution ensures seamless integration with state-of-the-art computing infrastructure, thus facilitating the shift towards more intelligent and modular computing environments which underpin the growth of AI-driven applications. The Photowave hardware is meticulously designed to uphold the highest standards in optical communication, ensuring fast data transfer capabilities that drastically reduce latency and improve the overall performance of computing tasks. In environments where swift and reliable data processing is paramount, Photowave stands out as a crucial component, helping optimize technological investments and boost the performance of AI and machine learning workloads.
StreamDSP's VITA 17.3 Serial FPDP Gen3 Solution is an advanced high-speed communication framework designed to meet the latest standards in data transfer technology. This solution offers improved data throughput and enhanced interoperability with existing systems, making it an invaluable asset for applications demanding the utmost precision and speed. Leveraging enhanced protocol designs, this IP solution integrates seamlessly with a broad array of FPGA platforms, providing users with unmatched performance and reliability in critical data communication setups. This makes it indispensable for applications in fields such as defense, scientific research, and real-time data processing.
The Regli PCIe Retimer by Kandou AI is a standout solution for high-performance communication in computer systems and data networks. Built to deliver extremely low latency under 10 nanoseconds, this retimer upholds exceptional signal integrity thanks to its ultra-low error rate of 1E-12. Designed for integration into PCIe networks, it supports data transactions at significant speeds, ensuring seamless communication between components. One of the main features of the Regli PCIe Retimer is its versatility in supporting PCIe 5.0 and CXL 2.0 standards, providing bidirectional data lanes capable of speeds up to 32 GT/s. The device is particularly suited for servers, workstations, and other systems requiring pristine data communication over extended distances. It excels within PCIe active cables and large network configurations such as in hyperscale data centers, offering massive data transfer benefits. Security is a top priority for the Regli PCIe Retimer, as it includes robust on-chip diagnostics and secure boot capabilities. Its design simplifies system architectures, providing system designers with flexible options to implement high-speed, reliable networks. With built-in control interfaces and flexible clock modes, this retimer is a dream solution for system architects who value both performance and security.
InnoSilicon's 56G SerDes Solution caters to the high-speed data transfer needs of today's semiconductor industry, offering a robust and flexible platform for a variety of high-bandwidth applications. This SerDes solution provides a comprehensive interface for seamless integration in networking and communication systems, including PCIe, USB, and Ethernet. Engineered for performance, the 56G SerDes boasts multi-protocol support, which allows for versatility in system design. It offers unmatched signal integrity, optimizing data rate speeds across various environments while minimizing electromagnetic interference. This ensures reliable communication channels capable of handling the complexities of modern digital data transfer. The solution's adaptability to different process nodes enhances its utility in diverse technological settings, promoting efficiency and reducing power consumption. It is especially suited for use in data centers, telecommunications infrastructure, and other areas where high-speed data processing is required. Through its advanced modulation techniques and streamlined architecture, the 56G SerDes Solution provides a valuable foundation for building next-generation networking solutions.
Aragio's LVDS solutions are tailored for high-speed data transmission up to 1 GHz for drivers and 1.2 GHz for receivers. Designed to meet the LVDS standard, the offering includes a CML interface to the core and power-up sequence independence. The solution provides flexibility with both 50Ω and 100Ω termination options, tailored to provide low power consumption while maintaining high performance. These features make it suitable for diverse high-speed data applications, ensuring reliability and energy efficiency.
The FireCore PHY & Link Layer solutions from DapTechnology provide state-of-the-art components crucial for implementing IEEE-1394 and AS5643 standards. Designed for adaptability, these solutions cater to multiple FPGA families, offering a combined PHY and LLC (Link Layer Controller) approach. They efficiently operate across a range of transmission speeds (S100 to S3200), making them valuable assets in various high-speed data environments. FireCore solutions are crafted with a focus on flexibility and reliability. They encompass significant enhancements such as configurable PHY ports, bit error injection, and rate testing features, catering to the diverse needs of modern digital communications. By integrating these dynamic capabilities, DapTechnology’s FireCore solutions improve packet management and overall network efficiency. Through continuous innovation, FireCore solutions have fortified DapTechnology's position as a leader in IEEE-1394 and Mil1394 technologies. These components provide the foundational architecture for performance-driven application in critical systems, especially within industries demanding high standards of data integrity and speed.
The APIX3 Transmitter and Receiver Modules represent the pinnacle of automotive data communication, offering superior bandwidth and versatility for in-car network architectures. Capable of handling up to 12Gbps with quad twisted pair connections, APIX3 supports Ultra High Definition video resolutions across multiple channels concurrently. These modules also feature robust diagnostic and cable monitoring capabilities, ensuring uninterrupted operation and ease of maintenance in automotive environments.
The SerDes IP by KNiulink Semiconductor is built using advanced architecture and technology, specifically crafted for applications demanding low power consumption and high performance. This IP showcases a high degree of configurability, making it seamlessly integrable into user logic or as part of an SOC.
The UCIe Chiplet Interconnect is an advanced solution facilitating unparalleled communication across chiplets, ensuring efficient system scalability and integration. This interconnect standard supports high data rates ranging from 24Gbps to 32Gbps, making it essential for cutting-edge multi-chip module (MCM) designs and System in Package (SiP) technologies. Designed with flexibility, it bridges various interfaces such as AXI and CHI, providing designers with versatile options for high-throughput interconnection across different silicon pieces. Its architecture supports both die-to-die and chip-to-chip communications, essential for modern heterogeneous applications that require diverse functionalities within a compact system footprint. InnoSilicon’s UCIe solution promotes seamless data exchange and minimizes bottlenecks, improving the efficiency of systems relying heavily on parallel processing and large data transfers. This technology plays a critical role in the rapid prototyping and mass production of high-performance computing systems and AI-powered devices. Supporting current and future process nodes, the UCIe Chiplet Interconnect ensures adaptability and relevance in an evolving semiconductor landscape, contributing to the growing demand for modular and customizable semiconductor infrastructure.
The SerDes telecommunications technology by Actt is crafted to efficiently transmit high-speed serial data signals over long distances with minimal degradation. SerDes, standing for Serializer/Deserializer, converts parallel data into serial form and vice versa, making it a critical component in high-speed communication applications. This IP supports a range of data rates and is designed to cater to the needs of modern high-performance systems requiring optimal data throughput. It ensures minimal signal loss and high data integrity, crucial for applications in data centers and high-speed computing networks. With its ability to handle extensive data transfer with precision, SerDes provides an essential link in maintaining robust communication channels. It is an adaptable solution that ensures scalability, meeting the ever-evolving demands of data processing environments.
The LineSpeed FLEX Family encompasses a range of 100G PHY products designed to facilitate high-speed communications across various interfaces, including retiming, gearbox functions, and multiplexing. These products comply with industry standards, such as IEEE, offering wide-ranging compatibility for diverse networking environments. Notably, the family supports a variety of data rates from 10G to 100G, allowing for mixed and independent port speeds. The retimers in particular are protocol-independent, providing a flexible solution adaptable to many networking configurations, particularly in line cards and modules, where space and efficiency are critical. The LineSpeed FLEX products also feature robust error correction capabilities, including on-chip RS-FEC. This assures data integrity across extensive network infrastructures, thus mitigating signal degradation over long distances. By simplifying the integration process and ensuring consistent performance, LineSpeed FLEX is integral to modern network practices, accommodating dense 10G Ethernet configurations and high-reliability systems.
Arkville is a formidable FPGA Gen5 PCIe DMA IP solution engineered to facilitate seamless data transfer between FPGA logic and host memory at remarkable speeds of up to 60 GBytes/s (480 Gbps) bidirectionally. This high-efficiency conduit substantially reduces CPU core utilization, obliterates the need for memory copies, and ultimately refines overall system efficiency. The IP core supports widespread industry-standard APIs for zero-copy user space memory handling, catering extensively to both hardware and software engineers involved in data production and consumption. This advanced data mover offers trusted and reliable PCIe DMA offload capabilities, facilitating rapid market deployment of FPGA-based packet processing solutions. By embracing modern standards such as DPDK and AXI, Arkville ensures compatibility across a broad spectrum of use cases. Vendor agnostic in its RTL support, Arkville caters to both Intel/PSG and AMD/Xilinx FPGA devices, further extending its versatility. Beyond its intrinsic features, the Arkville solution comes with a comprehensive suite of example designs, providing users with a solid foundation upon which they can build customized solutions. These examples showcase various network configurations, from multi-port scenarios to high-speed single-port operations, highlighting Arkville's adaptability to evolving packet processing requirements.
The 5G ORAN Base Station is set to redefine the landscape of mobile networking, vastly enhancing wireless data capacity and paving the way for innovative wireless applications. This product is designed to augment connectivity in both urban and rural settings, offering robust data handling capabilities and superior performance. By incorporating open RAN technology, it facilitates interoperability and vendor-neutral platforms, promoting innovation and flexibility. This cutting-edge base station supports a plethora of applications, allowing service providers to deliver high-speed 5G connectivity tailored to specific client needs. Its advanced architecture ensures seamless integration with existing network infrastructure, streamlining the adoption of next-gen technologies. Furthermore, the base station boasts energy-efficient design principles, presenting a sustainable option for expanding mobile broadband offerings. With its modular design, the 5G ORAN Base Station is versatile and scalable, suiting a range of deployment scenarios, from dense urban centers to remote and underserved areas. The inclusion of open interface standards accelerates innovation and reduces deployment costs, offering an optimal solution for service providers aiming to maximize their 5G network investments.
ChipBridge facilitates AXI4 protocol communication, extending it to external FPGAs for improved peripheral management. The simplicity of using only two signal pairs for connectivity allows for efficient use of space and resources, making it well-suited for complex systems looking to separate control and processing logic across chips. This IP enables seamless integration with various FPGA families, offering flexible and scalable system design options for high-performance applications that demand robust connectivity solutions without comprising on speed or efficiency.
IntelliProp's Switch and Endpoint Adapter is a dedicated solution designed to interface between various CXL-compliant devices and the Omega Fabric, providing a scalable infrastructure for memory and device interconnections. Serving as a vital component in memory networking, it connects CXL memory, GPUs, and other endpoint devices to the Omega Fabric. This adapter caters to multiple configurations, offering 4, 8, or 12 ports to accommodate various setup needs and support redundancy and congestion management through path duplication. Its versatility ensures high-throughput capabilities with support for CXL devices ranging from version 1.1 to 3.0, making it a future-proof component for data centers undergoing scalability expansions. The discrete switch supports an extensive 1200Gbps total fabric capacity and built-in Single Subnet/Single Route packet routing, ensuring efficient data packet management across various networks. This flexibility undershoots its role in enhancing seamless data flow across high-demand computing environments known for their complexity and performance needs.
The Universal Chiplet Interconnect Express (UCIe) offers a transformative approach to inter-chiplet communication, designed to elevate chiplet-based system designs. This interconnect facilitates high-speed, low-latency links crucial for the efficient operating of chiplets in sophisticated computing environments. With support for versions 1.x and 2.x, UCIe ensures robust connection integrity, offering bandwidths up to 32 Gbps. It is engineered for high scalability, supporting extensive chiplet configurations needed in next-gen processors and server designs. UCIe's architecture promotes seamless integration into complex system setups, enhancing performance in high-demand areas such as AI processing, server applications, and large-scale parallel computing systems.
GammaCORE UCIe Die-to-Die Controller offers precise control for die-to-die communications in modern computing architectures. Serving as a vital component in fragmented chip designs, this controller ensures seamless interconnectivity and functionality between discrete silicon dies. The GammaCORE is designed to excel in environments demanding high throughput and low latency communication. Its support for the UCIe protocol makes it adaptable for various chiplet configurations, thus promoting flexible design strategies across industry applications. With strong emphasis on reliability and efficiency, GammaCORE facilitates effective data flow, maintaining the integrity of operations in advanced computing systems. It underlines a pivotal shift towards modular electronics, accommodating complex designs with varying performance needs.
The Network Attached Memory (NAM) System by IntelliProp is an innovative 2U chassis solution designed to support and streamline next-generation memory pooling strategies. Capable of housing up to six EDSFF devices, this system allows for the integration and management of various CXL-based endpoints including memory, GPUs, and accelerators. Used as either a standalone added memory hub or an interconnected switch without endpoints, the NAM provides agile and flexible memory management within data centers. This feature allows enterprises to adapt to growing memory demands and efficiently distribute resources across various computational tasks, ensuring optimal performance and resource utilization. The NAM is designed to integrate seamlessly with other IntelliProp CXL-based technologies and can be customized to operate with pre-installed memory modules or remain unpopulated based on specific client requirements. As more enterprises adopt CXL standards for their operational infrastructure, the NAM offers a compatible and innovative solution ready for immediate deployment in contemporary data centers.
The Die-to-Die (2.5D/3D) offering from Global Unichip Corp. focuses on high-speed data interconnections for multiple die architectures. This innovative solution is vital for applications needing extensive data exchange between dies, which include those in networking and data center environments. By handling data rates efficiently, this IP addresses the increasing demand for higher data throughput while minimizing latency. It employs the latest advances in semiconductor packaging, allowing for versatile integration across diverse system architectures. Its adaptability ensures that it aligns with various manufacturing nodes and foundry processes, making it an excellent choice for numerous technological needs. Reliability is also a key focus, supported by a robust design strategy that ensures consistent performance under different operational conditions. The Die-to-Die technology supports not only improved bandwidth but also enhances thermal management across connected dies. This capability is crucial in ensuring seamless operation over prolonged periods, particularly in high-performance computing scenarios where heat dissipation can pose significant challenges.
The Aurora 8B/10B IP Core is a versatile serial protocol core that supports up to 6.6 Gbps per lane, providing an efficient solution for inter-FPGA communication or as an alternative to high-speed serial interfaces like PCI Express. This IP is compatible with various FPGA vendors, ensuring broad interoperability and application flexibility. It offers low latency and reliable data integrity through robust error-checking mechanisms, making it ideal for high-performance applications that require stable, fast data transfer, such as in telecommunications and high-speed computing.
The Aurora 64B/66B IP Core supports high-speed serial communication protocols, serving as a reliable link for chip-to-chip and board-to-board data transmission. Its compact design allows for efficient use of resources, making it suitable for demanding applications across multiple FPGA platforms and even ASIC implementations. The core is engineered to maintain high throughput and low latency, essential for applications like video data transfer or high-speed networking, due to its 97% bandwidth efficiency compared to other standards. Additionally, it ensures compatibility with Xilinx Aurora cores, allowing seamless integration in existing setups.
Designed to fulfill PCI-SIG’s stringent requirements, Atria Logic’s PCIe Gen1/2 PHY efficiently handles data communication over PCIe links. Supporting dual data speeds, this PHY core integrates seamlessly through a configurable PIPE interface and adheres closely to IEEE standards. Its minimal gate count architecture maximizes efficiency, making it a critical component in systems that necessitate rapid and stable data transfers. From high-performance computing to seamless device interconnection, this PHY ensures consistent performance and reliable execution across a spectrum of embedded applications.
The NVMe Validation Test Suite from Atria Logic provides a comprehensive suite for validating NVMe Controllers in post-silicon testing environments. It's structured to ensure complete compliance with UNH_IOL standards while offering additional test features, fostering an environment of reliability and performance verification. Compatible with Linux-based systems, this test suite enhances the design confidence and efficiency, enabling simulation and emulation environments to iteratively test NVMe functionalities seamlessly supported across multiple embedded systems. The tailored suite allows developers to extend NVMe testing capabilities with unparalleled ease.
The 32G UCIe PHY from Global Unichip Corp. represents a significant leap in physical layer technologies, designed to meet the demands of high-speed data communication. Targeting next-generation connectivity standards, this PHY is vital for boosting data throughput in interconnected systems, particularly those foundational to computing and networking architectures. Supporting a broad range of process technologies, this PHY offers exceptional versatility and performance, catering to extensive application needs. Its design ensures robust data integrity and minimal signal degradation, essential for maintaining high performance in data-critical environments such as data centers and enterprise networks. Engineered for seamless integration, the 32G UCIe PHY supports rapid deployment and compatibility with a diverse set of systems. Additionally, its enhanced signal processing capabilities make it suitable for applications where precision and high-quality data transmission are paramount, ensuring comprehensive support for modern technological demands.
The Truechip PCIe Gen4 Controller offers comprehensive support for the PCI Express 4.0 specification, enabling high-speed data transfer with enhanced performance features. It is designed to meet the growing demands for high-bandwidth connections in advanced computing and networking systems. Supporting multiple data lanes and backward compatibility with previous PCIe versions, this controller provides a flexible connectivity solution. Key attributes include advanced error correction techniques, lane equalization features, and enhanced data integrity measures, critical for maintaining top-tier performance in complex setups. Truechip's PCIe Gen4 Controller is ideal for integration into applications that require rapid data interchange, like high-performance computing and data-intensive tasks. Its robust architecture supports scalability and adaptability, ensuring seamless integration into evolving system designs.
The Die-to-Die (2.5D/3D) Interface at Global Unichip Corp. is pivotal for managing inter-die communication in integrated circuits. It serves high-performance computing and AI applications, enabling efficient data communication across various dies within an integrated system. Its design helps in minimizing latency and maximizing bandwidth, critical for modern computation-intensive tasks. This interface supports advanced packaging solutions, providing extensive variability in system design, from simple to complex structures. It aligns with various semiconductor nodes, ensuring compatibility and flexibility for different technological requirements. The interface is equipped to handle the demanding needs of modern processors and computing architectures. With a focus on thermal performance, the Die-to-Die Interface is engineered to support efficient heat dissipation, a critical need in high-density computing environments. Its robust design facilitates easier integration into a variety of system configurations, supporting the next wave of high-performance semiconductor advancements.
This library is a production-quality, silicon-proven custom Die-to-Die high speed interface available in TSMC’s 16nm process. The I/O cell is bidirectional, has two modes of operation: standard full rail to rail swing, or a custom low noise pseudo-differential interface. The RX cells have a weak pull-down feature.
The IntelliProp CXL Host Adapter provides a robust solution for memory expansion and pooling within the server environment, leveraging advanced CXL technology to bridge connections between multiple hosts. Featuring two CXL links and multiple Omega Fabric ports, the adapter card includes four DDR4 memory slots to enhance server memory capacity and facilitate memory sharing between paired CXL hosts. This adapter card supports a wide compatibility range, accommodating current CXL 1.1 host processors and extending future support to include upcoming versions like CXL 2.0 and 3.0. Equipped with a built-in switch, the CXL Host Adapter is designed to seamlessly integrate into complex data center environments, offering flexibility in routing and cascading configurations. The card's design considers high-speed connectivity, equipping it with four 25Gbps connections for an aggregate throughput of 400Gbps. This feature supports efficient memory integration and enhances data throughput capabilities, catering to the increasing demand for seamless, high-speed data operations in modern computing environments.
IntelliProp's Omega Fabric aims to revolutionize memory economics by providing an innovative CXL-based system that extends memory capacity within servers and facilitates connectivity to external pooled memory. Utilizing FPGA-based technology, the Omega Fabric system enables significant advancements in memory expansion capabilities and infrastructure flexibility for AI and hyperscale computing applications. The Omega Fabric creates advanced memory tiers by integrating multiple servers with a Network Attached Memory (NAM) system, connecting through 6m to 30m cables which support extensive pod and rack-scale deployments. This model supports the combination of different components such as EDSFF CXL memory, IntelliProp memory, and EDSFF CXL GPUs, thereby transforming memory performance and capacity. Designed to enhance existing memory architectures, Omega Fabric makes use of advanced host adapters, enabling seamless CXL integration, thereby enhancing local memory for real-time applications and distributing memory resources more efficiently. This refined approach to memory resource management drives significant improvements in data processing speed within the NUMA domain, tailored for in-memory database applications.
The GTS PMA/FEC Direct PHY is an advanced high-speed physical layer interface developed by Altera. Supporting next-generation serial protocols, it integrates forward error correction (FEC), which is essential for maintaining superior signal integrity. This product is engineered to deliver exceptional performance in terms of speed and reliability, making it a vital component for cutting-edge communication systems. Its design focuses on achieving superior signal processing, a requisite for modern telecommunication infrastructures that demand both precision and robustness. The integration of FEC enhances its efficiency by correcting errors in data transmission, thus ensuring continuous and error-free communications even in challenging environments. Altera's GTS PMA/FEC Direct PHY stands out in its category by providing high adaptability in various applications. It can be utilized in sectors such as data communication and networking, where high-speed data transfer and minimal data loss are critical. This PHY demonstrates Altera's excellence in offering products that meet the rigorous demands of cutting-edge digital communication technology.
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