All IPs > Interface Controller & PHY > Gen-Z
In the rapidly evolving world of data-intensive computing, Gen-Z semiconductor IPs play a crucial role in enhancing the performance and scalability of computing architectures. As part of the Interface Controller & PHY category, these IPs are engineered to support high-speed, low-latency communication between components in a compute system. Gen-Z is an open-systems interconnect, developed to meet the demands of modern workloads, such as data analytics, machine learning, and artificial intelligence. By providing a framework that features memory-semantic access to data, these semiconductor IPs enable seamless communication across multiple system components, optimizing both cost and performance.
Gen-Z interface controller and PHY semiconductor IPs are essential for developing interoperable and efficient data center solutions. They enable the seamless integration of resources such as memory, storage, and processors, reducing bottlenecks and enhancing data transfer efficiency. These IPs offer a scalable solution that allows for the dynamic sharing of these resources, resulting in improved utilization and flexibility. As workloads become increasingly complex, the ability to efficiently harness and manage resources becomes critical, and Gen-Z IPs are at the forefront, facilitating this capability through their innovative design.
These semiconductor IPs are leveraged in a broad range of applications where high throughput and low latency are essential. Data centers, high-performance computing environments, and enterprise networks can significantly benefit from the capabilities that Gen-Z IPs provide. They are instrumental in building infrastructures that require the rapid exchange of large volumes of data across various components, such as CPUs, GPUs, and storage devices. This makes them a vital component in the development of next-generation data centers and cloud computing architectures.
Inclusion of Gen-Z IP in the Interface Controller & PHY category promises continued advancement and improvement in computing capabilities, matching industry demands for more efficient, scalable, and powerful electronic systems. By addressing the communication challenges inherent in modern computing tasks, these semiconductor IPs promote innovation and provide a robust foundation for future developments in technology. Businesses and developers looking to stay ahead in the technology race can significantly benefit from incorporating these solutions into their products and systems, ensuring enhanced performance and competitiveness in a dynamic market.
Universal Chiplet Interconnect Express, or UCIe, is a forward-looking interconnect technology that enables high-speed data exchanges between various chiplets. Developed to support a modular approach in chip design, UCIe enhances flexibility and scalability, allowing manufacturers to tailor systems to specific needs by integrating multiple functions into a single package. The architecture of UCIe facilitates seamless data communication, crucial in achieving high-performance levels in integrated circuits. It is designed to support multiple configurations and implementations, ensuring compatibility across different designs and maximizing interoperability. UCIe is pivotal in advancing the chiplet strategy, which is becoming increasingly important as devices require more complex and diverse functionalities. By enabling efficient and quick interchip communication, UCIe supports innovation in the semiconductor field, paving the way for the development of highly efficient and sophisticated systems.
eSi-Connect offers an extensive suite of AMBA-compliant peripheral IPs designed to streamline SoC integration. This suite encompasses versatile memory controllers, standard off-chip interface support, and essential control functions. Its configurability and compatibility with low-level software drivers make it suitable for real-time deployment in complex system architectures, promoting reliable connectivity across various applications.
Credo Semiconductor excels in SerDes (Serializer/Deserializer) IP for custom ASICs, providing solutions that facilitate easy integration into various System on Chip (SoC) designs. The architecture of Credo's SerDes IP is based on a mixed-signal DSP approach that enhances performance while minimizing power and integration challenges. This architecture is especially beneficial for high-bandwidth data processing scenarios, making it an ideal choice for applications in AI, high-performance computing, and advanced telecommunication infrastructures.<br /><br />Their custom-built SerDes solutions stand out for the ability to handle tens and even hundreds of lanes, thanks to their innovative approach that seamlessly bridges the gap between core and analog logic deployment. These IPs are crafted to thrive even in mature process nodes, delivering remarkable efficiency in terms of power consumption and cost-effectiveness. By implementing these IPs, companies can ensure their systems are robust, future-proof, and capable of handling substantial data transmission tasks.<br /><br />Among the notable advantages offered by Credo’s SerDes IP is their adaptability with various signaling standards such as NRZ and PAM4, facilitating diverse data rate requirements up to 112G per lane. This flexibility not only aligns with current technological trends but also positions companies to swiftly adapt to future advancements in data communication technology, leveraging Credo's partnership with leading foundries and process nodes, such as TSMC's N3 and N5 technologies.
The AST 500 and AST GNSS-RF are multifaceted SOC and RF solutions designed for GNSS applications. They support a wide array of constellations such as GPS, GLONASS, NavIC, and others, in multiple frequency bands, enhancing navigation performance. These ICs integrate features like secure boots and data encryption, facilitating robust security measures crucial for sensitive data. The AST GNSS-RF is equipped with capabilities for L1, L2, L5, and S band reception, catering to high-fidelity signal requirements across various applications. The support for dual-band reception ensures that ionosphere errors are minimized, offering exceptional positioning accuracy.
ISPido on the VIP Board is tailored for Lattice Semiconductors' Video Interface Platform, providing a runtime solution optimized for delivering crisp, balanced images in real-time. This solution offers two primary configurations: automatic deployment for optimal settings instantly upon startup, and a manual, menu-driven interface allowing users to fine-tune settings such as gamma tables and convolution filters. Utilizing the CrossLink VIP Input Bridge with Sony IMX 214 sensors and an ECP5-85 FPGA, it provides HD output in HDMI YCrCb format, ensuring high-quality image resolution and real-time calibration.
LightningBlu is a state-of-the-art multi-gigabit connectivity solution for high-speed rail networks, delivering continuous high-speed data transfer between trackside and train systems. This innovative solution works within the mmWave spectrum of 57-71 GHz and is certified for long-term, low-maintenance deployment. It seamlessly integrates with existing trackside networks to provide a stable, high-capacity communication bridge essential for internet access, entertainment, and real-time information services aboard high-speed trains. The LightningBlu system includes robust trackside nodes and compact train-top nodes designed for seamless installation, significantly enhancing operational efficiencies and passenger experience by providing internet speeds superior to traditional mobile broadband services. With aggregate throughputs reaching around 3 Gbps, LightningBlu sets the standard for rail communications by supporting speeds at which data demands are met with ease. Crucially, LightningBlu is a key component in transforming the railway telecommunications landscape, offering upgraded technology that enables uninterrupted and enhanced passenger digital services even in the busiest railways across the UK and USA. Through its advanced mmWave technology, it ensures that the connectivity needs of the modern commuter are met consistently and effectively, paving the way for a new era in transit communication.
Silicon Library Inc. offers a high-quality DisplayPort/eDP IP that supports seamless transmission of audio and video data for modern display standards. Engineered for compatibility with DP/eDP 1.4 standards, this IP is geared toward contemporary computing and media devices requiring sharp and clear image displays. The DisplayPort/eDP interface is crucial for devices like monitors, laptops, and all-in-one PCs. It provides a robust link for transmitting high-definition content, capable of managing complex video signals with multiple streams efficiently. The IP is designed to support high-bandwidth communication, enabling it to handle resolutions required for newer display technologies, including 4K and 8K displays. Optimized for power and performance, the DisplayPort/eDP IP integrates features like adaptive sync, dynamic refresh rates, and multi-monitor support. Its low-power footprint and efficiency in managing resources make it suitable for portable and high-performance devices where display quality is paramount.
The BlueLynx Chiplet Interconnect system provides an advanced die-to-die connectivity solution designed to meet the demanding needs of diverse packaging configurations. This interconnect solution stands out for its compliance with recognized industry standards like UCIe and BoW, while offering unparalleled customization to fit specific applications and workloads. By enabling seamless connection to on-die buses and Networks-on-Chip (NoCs) through standards such as AMBA, AXI, ACE, and CHI, BlueLynx facilitates faster and cost-effective integration processes. The BlueLynx system is distinguished by its adaptive architecture that maximizes silicon utilization, ensuring high bandwidth along with low latency and power efficiency. Designed for scalability, the system supports a remarkable range of data rates from 2 to 40+ Gb/s, with an impressive bandwidth density of 15+ Tbps/mm. It also provides support for multiple serialization and deserialization ratios, ensuring flexibility for various packaging methods, from 2D to 3D applications. Compatible with numerous process nodes, including today’s most advanced nodes like 3nm and 4nm, BlueLynx offers a progressive pathway for chiplet designers aiming to streamline transitions from traditional SoCs to advanced chiplet architectures.
The eSi-Comms suite from EnSilica stands as a highly parametizable set of communications IP, integral for developing devices in the RF and communications sectors. This suite focuses on enhancing wireless performance and maintaining effective communication channels across various standards. The modular design ensures adaptability to multiple air interface standards such as Wi-Fi, LTE, and others, emphasizing flexibility and customizability.\n\nThis communication IP suite includes robust components optimized for low-power operation while ensuring high data throughput. These capabilities are particularly advantageous in designing devices where energy efficiency is as critical as communication reliability, such as in wearables and healthcare devices.\n\nMoreover, eSi-Comms integrates seamlessly into broader system architectures, offering a balanced approach between performance and resource utilization. Thus, it plays a pivotal role in enabling state-of-the-art wireless and RF solutions, whether for next-gen industrial applications or advanced consumer electronics.
Naneng Microelectronics offers a versatile Universal High-Speed SERDES capable of operating in a broad range of speeds from 1Gbps to 12.5Gbps. This SERDES is engineered to provide seamless and agile data transmission, underpinning critical communications infrastructure in various applications. The high-speed capabilities of this serializer/deserializer underline its suitability for high-performance networking solutions. Its flexible deployment options make it an ideal candidate for integration in a variety of system architectures, promoting a balance between speed and signal integrity. The design includes robust features to counter signal degradation and maintain the integrity of transmitted data, ensuring reliable operation across extensive data networks. Support for high data rates ensures this SERDES component meets and exceeds industry standards, delivering enhanced data throughput and supporting next-generation electronic systems. With adaptability at its core, the Universal High-Speed SERDES exemplifies comprehensive technological solutions in the semiconductor industry.
The Cyclone V FPGA with Integrated PQC Processor by ResQuant is a specialized product that comes pre-equipped with a comprehensive NIST PQC cryptography suite. This FPGA is tailored for applications requiring a robust proof-of-concept for quantum-safe implementations. It ensures seamless integration into existing systems, providing a practical platform for testing and deployment in quantum-secure environments. This product is available at a competitive price and represents an ideal starting point for entities looking to explore and adopt quantum-resilient technologies. Its configuration allows for straightforward implementation in diverse hardware infrastructures while offering a reliable option for organizations aiming to stay ahead in the evolving cyber security landscape. By incorporating the latest in cryptographic standards and ensuring vendor independence, the Cyclone V FPGA with Integrated PQC Processor by ResQuant effectively bridges current hardware technologies and future-proof security needs. It supports industry-wide applications, from IoT and ICT to automotive and military sectors, underscoring ResQuant's versatility in hardware security solutions.
Nextera Video's NMOS Control Platform is a vital component for ensuring seamless interoperation of SMPTE ST 2110 devices within multi-vendor IP networks. Developed by the Advanced Media Workflow Association (AMWA) and specified by the Joint Taskforce on Networked Media (JT-NM), the NMOS platform simplifies the management of media systems over IP, enabling plug-and-play interoperability in complex environments. This platform allows for automatic discovery and registration of devices, connection management, and resource labeling, which is crucial for effective system monitoring and control. Key features encompass a broad range of functionalities, including IP equivalent of GPIO events, real-time configuration of audio channels, and comprehensive system parameter management. These capabilities make it indispensable for operations demanding high-quality media routing and flexibility. NMOS is not only a means of efficient configuration but also enhances the security of media communications through integration with HTTPS and TLS standards. This ensures that only authorized users have access, thereby strengthening the integrity of media operations on the network. As a JT-NM tested solution, it guarantees adherence to industry standards, contributing to its widespread acceptance amongst broadcasters and media producers.
The NB-IoT (LTE Cat NB1) transceiver is a specialized solution catered to the unique requirements of large-scale IoT deployments within the realm of cellular networks. With a focus on low power consumption and enhanced coverage, this transceiver stands as a critical component for ensuring IoT connectivity across vast geographical distances. Its design facilitates extensive device interoperability and integration within existing LTE networks, enabling easy scalability and cost-effective implementation. The ability to handle numerous connections efficiently makes this transceiver vital for smart city projects, remote monitoring systems, and other IoT initiatives that demand long-range communication. Moreover, the NB-IoT transceiver’s adaptability allows it to penetrate barriers and reach locations where connectivity options are otherwise limited, ensuring continuous data exchange. This breadth of capability secures its position as a backbone for enabling ubiquitous IoT connectivity across diverse environments and use cases.
The MERA Compiler and Software Framework provides a comprehensive platform for deploying neural network models across various systems. Designed with a framework-agnostic approach, MERA allows developers to leverage predefined models from leading libraries such as Hugging Face, facilitating straightforward AI model deployment and integration without needing to dive into chip-level intricacies. Key to MERA's utility is its ability to optimize the deployment of AI inference by enabling deep neural network graph compilation via the Dynamic Neural Accelerator (DNA) architecture. MERA simplifies the process of deploying pre-trained neural networks by handling all aspects, from APIs, code generation, to runtime needs. It is especially adept at managing generative AI applications, giving users the capacity to generate novel content in fields like vision, language, and audio. MERA is compatible with an array of processing architectures, including AMD, Intel, Arm, and RISC-V. This ensures broad applicability and integration into existing infrastructures. Furthermore, it includes native support for popular machine learning frameworks like TensorFlow Lite and ONNX, making it a flexible solution for software developers and data scientists. Its open-source elements allow for easy distribution and collaboration across project teams, enhancing workflow integration and reducing the time-to-market for AI solutions.
This innovative system is designed to enhance the user experience of wireless power transfer applications by ensuring precise alignment and compatibility between power transmitters and receivers. It includes mechanisms for detecting the positioning of a device relative to a charging source, optimizing the alignment process to ensure efficient energy transfer. The system's compatibility detection capabilities allow it to recognize and adapt to various device specifications and charging standards, reducing the risk of charging errors and improving overall system reliability. With this system, users can achieve optimal alignment automatically, making the process of wireless charging simpler and more intuitive. The technology is particularly beneficial in scenarios where positioning is critical for energy transfer efficiency, such as in automotive or portable device applications. It addresses common challenges in wireless power systems, such as alignment drift and signal path obstructions, ensuring that power is delivered smoothly and consistently.
The INAP375R Receiver is a component of the APIX2 technology suite, tailored to meet the stringent demands of automotive infotainment systems. It supports bi-directional, high-speed data transfer over a single twisted pair cable, up to distances of 12 meters, offering flexibility for complex vehicle architectures. The receiver integrates advanced error correction protocols and supports RGB and LVDS video interfaces, making it ideal for high-definition display applications in vehicles.
The APIX3 Transmitter and Receiver Modules represent the pinnacle of automotive data communication, offering superior bandwidth and versatility for in-car network architectures. Capable of handling up to 12Gbps with quad twisted pair connections, APIX3 supports Ultra High Definition video resolutions across multiple channels concurrently. These modules also feature robust diagnostic and cable monitoring capabilities, ensuring uninterrupted operation and ease of maintenance in automotive environments.
The UCIe Chiplet Interconnect is an advanced solution facilitating unparalleled communication across chiplets, ensuring efficient system scalability and integration. This interconnect standard supports high data rates ranging from 24Gbps to 32Gbps, making it essential for cutting-edge multi-chip module (MCM) designs and System in Package (SiP) technologies. Designed with flexibility, it bridges various interfaces such as AXI and CHI, providing designers with versatile options for high-throughput interconnection across different silicon pieces. Its architecture supports both die-to-die and chip-to-chip communications, essential for modern heterogeneous applications that require diverse functionalities within a compact system footprint. InnoSilicon’s UCIe solution promotes seamless data exchange and minimizes bottlenecks, improving the efficiency of systems relying heavily on parallel processing and large data transfers. This technology plays a critical role in the rapid prototyping and mass production of high-performance computing systems and AI-powered devices. Supporting current and future process nodes, the UCIe Chiplet Interconnect ensures adaptability and relevance in an evolving semiconductor landscape, contributing to the growing demand for modular and customizable semiconductor infrastructure.
The INAP590T is a transmitter module embedded within the APIX3 framework, delivering unparalleled data transfer capabilities for high-resolution automotive display systems. It supports HDMI 1.4a video interface and integrates seamlessly with existing in-car networks. This module offers advanced features such as scalable bandwidth, cable adaptability, and error correction, making it a reliable choice for next-generation infotainment architectures.
Our PCIe Gen6 with CXL 3.0 integration stands at the forefront of next-generation interfaces, delivering massive bandwidth and minimal latency for demanding computational tasks. Reaching data rates up to 64 GT/s, it offers profound improvements in speed and connectivity for cutting-edge technology deployments. This integration allows for dramatic enhancements in coherent memory sharing capabilities and efficient resource utilization across accelerator and server environments. The Gen6 PCIe, combined with CXL 3.0, supports increased scalability and bandwidth, making it ideal for everything from data-centric computing to high-frequency trading platforms. Security remains a priority, with added layers of data protection to ensure safe transfer processes, underscoring its suitability for sensitive applications requiring absolute reliability.
The EPC Gen2/ISO 18000-6 Digital Protocol Engine by RADLogic is crafted for superior digital protocol processing. This engine is compliant with the EPC Gen 2 Class 1 protocol (V1.2), ensuring it meets industry standards efficiently. It is designed to manage the complex operations associated with RFID systems, facilitating accurate and reliable communication between tags and readers. The engine supports high-speed processing, reducing latency and enhancing the throughput of RFID systems. Its robust architecture supports various digital operations required for protocol management, making it an essential component in advanced RFID tagging systems. The digital protocol engine is developed with a focus on scalability, allowing it to be integrated easily into existing systems regardless of their complexity or scale. RADLogic has designed this engine with a keen awareness of industry requirements, ensuring adaptability to various operational environments. One of the standout features of this digital engine is its low power consumption, which aligns with modern requirements for sustainable and energy-efficient technologies. Additionally, its compatibility with other RFID applications enables seamless transitions across different technologies and environments, providing a flexible solution to meet diverse client needs.
The CXL 2.0 product line offers cutting-edge performance features that make it ideal for modern high-performance computing tasks. This IP enables coherent memory access in heterogenous compute systems, efficiently supporting multi-tiered memory architectures and decoupling memory from compute resources to optimize system performance. CXL 2.0 is engineered to enhance bandwidth and reduce latency between CPUs and accelerators, operating efficiently across different computational environments. It delivers distinct advantages in workload distribution and improved data management capabilities, essential for advanced computing tasks in AI and machine learning. The architecture further includes advanced security features, facilitating safe and reliable processing in complex data environments. Its seamless memory pooling and management capabilities make it indispensable for edge computing and cloud data management systems.
The Universal Chiplet Interconnect Express (UCIe) offers a transformative approach to inter-chiplet communication, designed to elevate chiplet-based system designs. This interconnect facilitates high-speed, low-latency links crucial for the efficient operating of chiplets in sophisticated computing environments. With support for versions 1.x and 2.x, UCIe ensures robust connection integrity, offering bandwidths up to 32 Gbps. It is engineered for high scalability, supporting extensive chiplet configurations needed in next-gen processors and server designs. UCIe's architecture promotes seamless integration into complex system setups, enhancing performance in high-demand areas such as AI processing, server applications, and large-scale parallel computing systems.
The INAP375T Transmitter is a high-speed data transmission solution specifically designed for the automotive industry. It employs the second generation APIX2 technology, which delivers high-speed differential data through a single twisted pair cable, supporting data rates up to 3Gbps. This transmitter can handle complex multimedia data like video and audio while maintaining robust error correction through the AShell protocol, ensuring reliable data communication within vehicles.
FlexGen Smart Network-on-Chip represents a leap forward in NoC design, driven by AI-based heuristics. This technology focuses on minimizing wire length, refining topology, and reducing latency, boosting productivity and enhancing SoC efficiency. This smart NoC extends capabilities to automate high-performance network-on-chip designs, achieving productivity improvements up to tenfold and reducing wire length by up to 30%. Offering a new level of automation, it embeds advanced features for dynamic priority handling and congestion management. FlexGen Smart NoC's integration boosts the technological potential of network designs, underpinning improved performance and cost-efficiency in any application, from automotive systems to advanced computing solutions.
The DXD GPU series excels in providing high-fidelity graphics tailored for desktop and data center operations. Offering direct compatibility with DirectX 11 and 12, as well as Vulkan, the DXD is optimized for complex rendering tasks and compute workloads common in high-performance PC and cloud environments. It aims to deliver seamless graphics performance, making it ideal for gaming and professional visualization applications.
APIX3 Technology expands upon previous generations by providing up to 12Gbps data transfer over simple shielded twisted pair or advanced quad twisted pair cables. This capability supports multiple high-definition video streams for advanced infotainment and cockpit applications. It enhances flexibility and performance in automotive networking through backward compatibility, full duplex communication, and advanced diagnostic and cable monitoring features.
APIX2 Technology is the second generation of automotive high-speed communication solutions designed for the integration of video, audio, and data in a single serial link. It maximizes data throughput over twisted pair cables, offering low latency and high reliability for automotive applications. APIX2 supports a wide array of interfaces, including RGB and LVDS video, which makes it versatile for modern vehicle requirements.
IntelliProp's Omega Fabric aims to revolutionize memory economics by providing an innovative CXL-based system that extends memory capacity within servers and facilitates connectivity to external pooled memory. Utilizing FPGA-based technology, the Omega Fabric system enables significant advancements in memory expansion capabilities and infrastructure flexibility for AI and hyperscale computing applications. The Omega Fabric creates advanced memory tiers by integrating multiple servers with a Network Attached Memory (NAM) system, connecting through 6m to 30m cables which support extensive pod and rack-scale deployments. This model supports the combination of different components such as EDSFF CXL memory, IntelliProp memory, and EDSFF CXL GPUs, thereby transforming memory performance and capacity. Designed to enhance existing memory architectures, Omega Fabric makes use of advanced host adapters, enabling seamless CXL integration, thereby enhancing local memory for real-time applications and distributing memory resources more efficiently. This refined approach to memory resource management drives significant improvements in data processing speed within the NUMA domain, tailored for in-memory database applications.
Join the world's most advanced semiconductor IP marketplace!
It's free, and you'll get all the tools you need to discover IP, meet vendors and manage your IP workflow!
No credit card or payment details required.
Join the world's most advanced AI-powered semiconductor IP marketplace!
It's free, and you'll get all the tools you need to advertise and discover semiconductor IP, keep up-to-date with the latest semiconductor news and more!
Plus we'll send you our free weekly report on the semiconductor industry and the latest IP launches!