All IPs > Interface Controller & PHY > Interlaken
Interlaken, a hybrid of Interconnect and Ethernet, is a high-speed data communication protocol designed to improve bandwidth efficiency and scalability in data transmission systems. Within the Interface Controller & PHY category, Interlaken semiconductor IPs play a crucial role in facilitating high-speed data interfaces between networking devices for modern data centers and telecommunication systems. This category encompasses a range of specialized IP solutions designed to address the rapidly growing demand for powerful networking communications.
Interlaken Interface Controllers are integral to managing the flow of data packets across the various channels in a network. These semiconductor IPs are designed to optimize the movement of data, ensuring efficient handling of multiple, simultaneous data streams. By employing advanced protocol management techniques, Interlaken controllers help reduce latency and increase throughput, making them ideal for use in high-performance computing environments, cloud infrastructure, and large-scale enterprise networks.
The Physical layer (PHY) IPs for Interlaken are tailored to enhance the physical connection between network devices. These IPs ensure reliable high-speed transmission by implementing state-of-the-art signal processing methods and robust error-correction mechanisms. This not only supports scaling to higher bandwidths but also ensures data integrity across complex networking topologies. As data demands surge, the ability to support rapid and reliable data transfer becomes indispensable, particularly for service providers and data center operators looking to maintain competitive advantages in latency-sensitive applications.
Products in the Interlaken Interface Controller & PHY category are essential for developers aiming to integrate cutting-edge communication technologies into their hardware designs. They provide an efficient solution for scaling performance, supported by proven interoperability in multi-vendor ecosystems. By leveraging these semiconductor IPs, designers can accelerate time-to-market, reduce developmental risks, and deliver solutions that satisfy the high-speed connectivity demands of the modern digital world.
The AHB-Lite APB4 Bridge serves as a crucial interconnect that facilitates communication between the AMBA 3 AHB-Lite and AMBA APB bus protocols. As a parameterized soft IP, it offers flexibility and adaptability in managing system interconnections, bridging the gap between high-speed and low-speed peripherals with efficiency. The bridge's architecture is designed to maintain data integrity while transferring information across different protocol tiers. This bridge supports the implementation of a seamless transition for data exchanges, ensuring data packets are transmitted with minimal latency. It is ideal for systems that require stable connectivity across multiple peripheral interfaces, delivering a cohesive platform for system designers to enhance operational uniformity. By enabling efficient bus conversion, it supports broader system architectures, contributing to the overall efficiency of embedded designs. With its open-architecture design, the AHB-Lite APB4 Bridge caters to a wide range of applications, providing necessary adaptability to meet the unique demands of each project. Its robust design ensures that it can accommodate the complex architectures of modern embedded systems, enhancing both performance and reliability.
The Multi-Protocol SERDES offered by Pico Semiconductor is a versatile solution capable of handling a variety of communication protocols. This series of SERDES includes a 4-channel configuration that supports data rates up to 32Gbps, designed for integration with XAUI, RXAUI, and SGMII. It is compatible with multiple process nodes provided by foundries like TSMC and GF, offering robust performance across different semiconductor environments. These SERDES are crafted to meet high-performance metrics, capturing speeds up to 16Gbps and 6.5Gbps across various models, with advanced versions reaching up to 32Gbps. This exceptional range not only ensures compatibility with current technologies but also prepares systems for future updates, sustaining high data throughput. By delivering reliable high-speed data transmission capabilities, the Multi-Protocol SERDES from Pico Semiconductor is integral for networking, high-speed computing, and data storage applications, where efficient and speedy data transfer is paramount.
The Multi-Protocol SerDes provided by Silicon Creations serves as an essential component for high-speed data interfaces across multiple industry protocols. This SerDes portfolio accommodates a vast array of protocols such as PCIe, JESD204, XAUI, and many more, facilitating broad compatibility with industry standards. Operating across 12nm to 180nm processes, these interfaces support data rates from 100 Mbps to an impressive 32.75 Gbps. Incorporating advanced features like programmable de-serialization widths and adaptive equalization, the Multi-Protocol SerDes ensures optimal signal integrity and performance even in demanding environments. The design includes jitter cleaner functions and employs low-latency optimized PMAs, delivering high precision and speed across various operational scenarios. This comprehensive adaptability ensures seamless integration into a wide range of applications from communications to high-performance computing. Supported by robust architectures, the SerDes enables enhanced efficiency and reliability, featuring low power consumption and reduced area overheads. With a commitment to customer satisfaction, Silicon Creations offers complete solutions through partnerships with leading controller vendors, cementing its products as high-value choices for modern electronic systems.
Credo Semiconductor excels in SerDes (Serializer/Deserializer) IP for custom ASICs, providing solutions that facilitate easy integration into various System on Chip (SoC) designs. The architecture of Credo's SerDes IP is based on a mixed-signal DSP approach that enhances performance while minimizing power and integration challenges. This architecture is especially beneficial for high-bandwidth data processing scenarios, making it an ideal choice for applications in AI, high-performance computing, and advanced telecommunication infrastructures.<br /><br />Their custom-built SerDes solutions stand out for the ability to handle tens and even hundreds of lanes, thanks to their innovative approach that seamlessly bridges the gap between core and analog logic deployment. These IPs are crafted to thrive even in mature process nodes, delivering remarkable efficiency in terms of power consumption and cost-effectiveness. By implementing these IPs, companies can ensure their systems are robust, future-proof, and capable of handling substantial data transmission tasks.<br /><br />Among the notable advantages offered by Credo’s SerDes IP is their adaptability with various signaling standards such as NRZ and PAM4, facilitating diverse data rate requirements up to 112G per lane. This flexibility not only aligns with current technological trends but also positions companies to swiftly adapt to future advancements in data communication technology, leveraging Credo's partnership with leading foundries and process nodes, such as TSMC's N3 and N5 technologies.
The BlueLynx Chiplet Interconnect system provides an advanced die-to-die connectivity solution designed to meet the demanding needs of diverse packaging configurations. This interconnect solution stands out for its compliance with recognized industry standards like UCIe and BoW, while offering unparalleled customization to fit specific applications and workloads. By enabling seamless connection to on-die buses and Networks-on-Chip (NoCs) through standards such as AMBA, AXI, ACE, and CHI, BlueLynx facilitates faster and cost-effective integration processes. The BlueLynx system is distinguished by its adaptive architecture that maximizes silicon utilization, ensuring high bandwidth along with low latency and power efficiency. Designed for scalability, the system supports a remarkable range of data rates from 2 to 40+ Gb/s, with an impressive bandwidth density of 15+ Tbps/mm. It also provides support for multiple serialization and deserialization ratios, ensuring flexibility for various packaging methods, from 2D to 3D applications. Compatible with numerous process nodes, including today’s most advanced nodes like 3nm and 4nm, BlueLynx offers a progressive pathway for chiplet designers aiming to streamline transitions from traditional SoCs to advanced chiplet architectures.
The 10G TCP Offload Engine from Intilop brings a transformative approach to network protocol processing. Designed to handle TCP processing tasks, this engine ensures efficient data transmission by offloading TCP processing from the CPU, thus optimizing the resources available for other critical computing tasks. With features focused on reducing latency and increasing throughput, the 10G TOE is ideal for high-performance computing environments and data centers where speed and efficiency are paramount. The engine showcases Intilop's core expertise in delivering ultra-reliable and rapid networking solutions, providing support for multiple concurrent sessions with consistent low latency. Professionals in cloud services and enterprise networking will find the integration capabilities of the 10G TOE highly beneficial, as it supports a comprehensive suite of features that extend beyond traditional TCP processing, reinforcing security and operational efficiency.
Analog Bits provides robust I/O solutions that are essential for the efficient transfer of signals between semiconductor devices and their external environment. These input/output interfaces are designed to meet the most demanding performance criteria, ensuring fast data rates and minimal signal distortion. Their I/O IP solutions can accommodate a variety of protocols, including high-speed digital interfaces and analog conversions, offering versatility and support for applications such as networking, data processing, and consumer electronics. By optimizing the signal integrity and electromagnetic compatibility, these I/Os enhance the overall system performance. Equipped with advanced features for low power consumption, these I/Os contribute to reducing the overall energy footprint of semiconductor devices, making them ideal for battery-operated devices and environmentally sensitive applications. Analog Bits' I/Os are comprehensively integrated to function seamlessly within mixed-signal environments, further broadening their application range.
The JESD204B Multi-Channel PHY from Naneng Microelectronics is designed to meet the rigorous demands of high-speed data transmission. Featuring a data rate capability of up to 12.5Gbps, this physical layer multi-channel interface supports a wide array of applications requiring reliable and efficient data transfer. Its versatile architecture ensures seamless integration into complex systems, providing robust performance benefits in the field of data communications. A comprehensive design enhances usability and flexibility, allowing customization for specific industrial needs. This PHY is particularly adept in high-density environments, ensuring precision synchronization across multiple channels, critical for signal integrity in today's intricate electronic ecosystems. Furthermore, the solution's efficient layout allows for ease of interoperability with existing infrastructure, reducing integration costs and time-to-market for end-users. This makes the JESD204B Multi-Channel PHY an attractive choice for enterprises aiming for optimal performance in digital communication systems without compromising efficiency.
The Cyclone V FPGA with Integrated PQC Processor by ResQuant is a specialized product that comes pre-equipped with a comprehensive NIST PQC cryptography suite. This FPGA is tailored for applications requiring a robust proof-of-concept for quantum-safe implementations. It ensures seamless integration into existing systems, providing a practical platform for testing and deployment in quantum-secure environments. This product is available at a competitive price and represents an ideal starting point for entities looking to explore and adopt quantum-resilient technologies. Its configuration allows for straightforward implementation in diverse hardware infrastructures while offering a reliable option for organizations aiming to stay ahead in the evolving cyber security landscape. By incorporating the latest in cryptographic standards and ensuring vendor independence, the Cyclone V FPGA with Integrated PQC Processor by ResQuant effectively bridges current hardware technologies and future-proof security needs. It supports industry-wide applications, from IoT and ICT to automotive and military sectors, underscoring ResQuant's versatility in hardware security solutions.
The Chiplet Interface solutions provided by Neuron IP include cutting-edge PHY & D2D Adapter IP for chiplet products. These solutions are built around the latest UCIe v1.1 specification and are designed to support a wide range of application verticals. They are well-known for their unparalleled PPA-differentiated architecture, which includes 32Gbps UCIe-Advanced and Standard cores. These interfaces are set to revolutionize the way microprocessors work in ultra-low latency environments, enhancing both performance and efficiency.
The CAN 2.0/CAN FD Controller offered by Synective Labs is a comprehensive CAN controller suitable for integration into both FPGAs and ASICs. This controller is fully compliant with the ISO 11898-1:2015 standard, supporting both traditional CAN and the more advanced CAN FD protocols. The CAN FD protocol enhances the original CAN capabilities by transmitting payloads at increased bitrates up to 10 Mbit/s and accommodating longer payloads of up to 64 bytes compared to the standard 8 bytes. This controller integrates seamlessly with a variety of FPGA devices from leading manufacturers such as Xilinx, Altera, Lattice, and Microsemi. It supports native bus interfaces including AXI, Avalon, and APB, making it versatile and highly compatible with various processing environments. For those deploying System on Chip (SOC) type FPGAs, the controller offers robust processor integration options, making it an ideal choice for complex applications. A standout feature of this IP is its focus on diagnostics and CAN bus debugging, which makes it particularly beneficial for applications like data loggers. These diagnostic features can be selectively disabled during the build process to reduce the controller's footprint for more traditional uses. With its low-latency DMA, interrupt rate adaptation, and configurable hardware buffer size, this CAN controller is engineered for high efficiency and flexibility across different applications.
Photowave optical communications hardware is expertly crafted for the emerging needs of AI memory applications requiring disaggregated resources. Specifically engineered to be compatible with PCIe 5.0/6.0 and CXL 2.0/3.0, Photowave capitalizes on photonics to provide superior latency and energy efficiency. This technology is a game-changer for data centers, offering managers the ability to scale resources flexibly either within individual racks or across multiple server racks, paving the way for more adaptive and powerful data management solutions. By embracing the fundamental strengths of photonics, Photowave empowers large-scale computing systems to achieve previously unattainable levels of efficiency and responsiveness. This optical communication solution ensures seamless integration with state-of-the-art computing infrastructure, thus facilitating the shift towards more intelligent and modular computing environments which underpin the growth of AI-driven applications. The Photowave hardware is meticulously designed to uphold the highest standards in optical communication, ensuring fast data transfer capabilities that drastically reduce latency and improve the overall performance of computing tasks. In environments where swift and reliable data processing is paramount, Photowave stands out as a crucial component, helping optimize technological investments and boost the performance of AI and machine learning workloads.
InnoSilicon's 56G SerDes Solution caters to the high-speed data transfer needs of today's semiconductor industry, offering a robust and flexible platform for a variety of high-bandwidth applications. This SerDes solution provides a comprehensive interface for seamless integration in networking and communication systems, including PCIe, USB, and Ethernet. Engineered for performance, the 56G SerDes boasts multi-protocol support, which allows for versatility in system design. It offers unmatched signal integrity, optimizing data rate speeds across various environments while minimizing electromagnetic interference. This ensures reliable communication channels capable of handling the complexities of modern digital data transfer. The solution's adaptability to different process nodes enhances its utility in diverse technological settings, promoting efficiency and reducing power consumption. It is especially suited for use in data centers, telecommunications infrastructure, and other areas where high-speed data processing is required. Through its advanced modulation techniques and streamlined architecture, the 56G SerDes Solution provides a valuable foundation for building next-generation networking solutions.
The Interlaken PHY Solution by StreamDSP serves as a high-performance interface solution designed for high-speed data systems. It employs the Interlaken protocol, which is specialized in managing chip-to-chip communications at high data rates while ensuring minimal overhead. The solution is optimized to provide a balance between performance and resource utilization, supporting a wide range of operating environments and requirements. Its versatility makes it ideal for networking, data center, and high-performance computing applications, where reliable and rapid data transmission is crucial.
LTTS's USB solutions provide a comprehensive range of high-speed data transfer capabilities, supporting up to 10 Gbps. As a leader in USB technology innovation, our solutions encompass the latest USB standards, facilitating swift and seamless data exchange across various devices. This suite of USB solutions is essential for devices that prioritize high data transfer rates to optimize user interactions with technology. These solutions are designed to support USB 3.0, 3.1, and 3.2 standards, allowing both backward compatibility and future-proofing for devices. Consequently, manufacturers can ensure ongoing support for a wide array of peripherals, from legacy USB components to the latest high-speed interfaces. This versatility positions LTTS’s USB technology at the forefront of connectivity innovations. Impressive in its adaptability, LTTS's USB solutions cater to a broad range of electronic components, including portable devices, computers, and peripherals that demand efficient and rapid data processing. By enabling such dynamic connectivity, LTTS aids in building comprehensive ecosystems that align with users' intricate, fast-paced digital requirements.
Mobiveil's RapidIO Verification IP (VIP) provides a robust compliance verification solution for the RapidIO protocol. It is structured on System Verilog and compatible with the Universal Verification Methodology (UVM), allowing seamless integration with other verification environments. This IP achieves comprehensive protocol validation through logical, transport, and physical layers, employing protocol monitors for accurate checks and coverage hooks. Its extensive compliance testing ensures that designs pass all protocol scenarios, facilitating verification efforts at IP, system-on-chip, or full system levels.
This high-performance bridge IP from Mobiveil leverages FPGA technology to facilitate communication between PCI Express and Serial RapidIO systems. By integrating PCIe versatility with SRIO's low-latency, high-throughput capabilities, this bridge enables line-rate data transfers, ideal for environments requiring robust data communication such as telecommunications and medical imaging. It features sophisticated DMA and messaging engines that efficiently manage data processing while minimizing power requirements, making it perfect for a range of embedded systems.
The RapidIO to AXI Bridge offered by Mobiveil acts as a versatile protocol converter between RapidIO and AXI systems. It supports flexible configurations tailored to host or device roles, employing multi-channel DMA and messaging controllers for bandwidth alignment between RapidIO and system requirements. This adaptability provides significant advantages for high-performance computing settings, including defense and aerospace applications.
DapTechnology's FireTrac AS5643 interface cards are crafted to enhance Mil1394 data processing. Recognized for their advanced capabilities, these cards offer crucial support for simulation and testing, making them an industry-approved choice for aerospace applications. The product line showcases DapTechnology's commitment to providing robust solutions for IEEE-1394 and Mil1394 data protocols, ensuring reliable data handling in critical environments. The FireTrac interface cards incorporate the functionalities needed for seamless AS5643 integration, including data encapsulation and decapsulation at unprecedented benchmarks. This enhances compatibility and performance within aerospace projects. DapTechnology's FireTrac cards offer comprehensive support for various interfaces, aligning with evolving industry standards and client requirements. Engineered with precision, the FireTrac series extends DapTechnology's legacy in interface solutions. These cards support a variety of Mil1394 environments, enabling high-speed data transmission and accurate signal processing, which are essential for the rigorous demands of modern avionics systems. With their innovative technology, FireTrac cards promote the development of robust and scalable aerospace network systems.
Arkville is a formidable FPGA Gen5 PCIe DMA IP solution engineered to facilitate seamless data transfer between FPGA logic and host memory at remarkable speeds of up to 60 GBytes/s (480 Gbps) bidirectionally. This high-efficiency conduit substantially reduces CPU core utilization, obliterates the need for memory copies, and ultimately refines overall system efficiency. The IP core supports widespread industry-standard APIs for zero-copy user space memory handling, catering extensively to both hardware and software engineers involved in data production and consumption. This advanced data mover offers trusted and reliable PCIe DMA offload capabilities, facilitating rapid market deployment of FPGA-based packet processing solutions. By embracing modern standards such as DPDK and AXI, Arkville ensures compatibility across a broad spectrum of use cases. Vendor agnostic in its RTL support, Arkville caters to both Intel/PSG and AMD/Xilinx FPGA devices, further extending its versatility. Beyond its intrinsic features, the Arkville solution comes with a comprehensive suite of example designs, providing users with a solid foundation upon which they can build customized solutions. These examples showcase various network configurations, from multi-port scenarios to high-speed single-port operations, highlighting Arkville's adaptability to evolving packet processing requirements.
Our PCIe Gen6 with CXL 3.0 integration stands at the forefront of next-generation interfaces, delivering massive bandwidth and minimal latency for demanding computational tasks. Reaching data rates up to 64 GT/s, it offers profound improvements in speed and connectivity for cutting-edge technology deployments. This integration allows for dramatic enhancements in coherent memory sharing capabilities and efficient resource utilization across accelerator and server environments. The Gen6 PCIe, combined with CXL 3.0, supports increased scalability and bandwidth, making it ideal for everything from data-centric computing to high-frequency trading platforms. Security remains a priority, with added layers of data protection to ensure safe transfer processes, underscoring its suitability for sensitive applications requiring absolute reliability.
Key ASIC's suite of Interface IPs is designed to enable seamless integration of communication features in high-performance systems. Among the key offerings are USB 2.0 and 3.0 PHYs which include host, device, and OTG capabilities, enabling robust external device connectivity crucial for modern electronics. The Ethernet MAC/PHY interfaces provide 10/100 connectivity, extending devices' network capabilities. They also offer PCI and PCIe PHY for high-speed data transfer applications essential in computing and communication sectors. The MIPI interfaces cater to high-speed mobile and display applications, ensuring data integrity and speed. In addition to these, Key ASIC's portfolio includes support for a wide range of high-speed serial links like LVDS, SATA, and RapidIO, making their Interface IP well-suited for complex multi-channel communication systems and ensuring streamlined data bus management. These interfaces support cutting-edge applications including consumer electronics, telecommunications infrastructure, and industrial control systems.
ChipBridge facilitates AXI4 protocol communication, extending it to external FPGAs for improved peripheral management. The simplicity of using only two signal pairs for connectivity allows for efficient use of space and resources, making it well-suited for complex systems looking to separate control and processing logic across chips. This IP enables seamless integration with various FPGA families, offering flexible and scalable system design options for high-performance applications that demand robust connectivity solutions without comprising on speed or efficiency.
The CXL 2.0 product line offers cutting-edge performance features that make it ideal for modern high-performance computing tasks. This IP enables coherent memory access in heterogenous compute systems, efficiently supporting multi-tiered memory architectures and decoupling memory from compute resources to optimize system performance. CXL 2.0 is engineered to enhance bandwidth and reduce latency between CPUs and accelerators, operating efficiently across different computational environments. It delivers distinct advantages in workload distribution and improved data management capabilities, essential for advanced computing tasks in AI and machine learning. The architecture further includes advanced security features, facilitating safe and reliable processing in complex data environments. Its seamless memory pooling and management capabilities make it indispensable for edge computing and cloud data management systems.
The Aurora 8B/10B IP Core is a versatile serial protocol core that supports up to 6.6 Gbps per lane, providing an efficient solution for inter-FPGA communication or as an alternative to high-speed serial interfaces like PCI Express. This IP is compatible with various FPGA vendors, ensuring broad interoperability and application flexibility. It offers low latency and reliable data integrity through robust error-checking mechanisms, making it ideal for high-performance applications that require stable, fast data transfer, such as in telecommunications and high-speed computing.
The Aurora 64B/66B IP Core supports high-speed serial communication protocols, serving as a reliable link for chip-to-chip and board-to-board data transmission. Its compact design allows for efficient use of resources, making it suitable for demanding applications across multiple FPGA platforms and even ASIC implementations. The core is engineered to maintain high throughput and low latency, essential for applications like video data transfer or high-speed networking, due to its 97% bandwidth efficiency compared to other standards. Additionally, it ensures compatibility with Xilinx Aurora cores, allowing seamless integration in existing setups.
The SPWN is a high-performance SpaceWire Node IP designed to facilitate robust communication within space and aerospace systems. It supports external SpaceWire interfaces alongside internal AXI-Stream capabilities, achieving data transmission speeds of up to 200 Mbps. Engineered for compliance with ECSS-E-ST-50-12C standards, SPWN offers seamless integration and management through an AXI4-Lite management interface featuring statistical registers. This compliance ensures interoperability and reliable performance in specialized domains requiring stringent operation criteria. SPWN’s design caters to the needs of aerospace and research institutions that demand high fidelity and reliable data exchange over extended periods. Its flexibility and robust connectivity make it essential in applications requiring constant communication reliability and adaptability in the harsh conditions of space.
The JESD204 IP is crafted for interfacing FPGAs with high-speed ADCs and DACs, facilitating efficient data conversion and processing. This IP supports multiple JESD204 standards, including the latest JESD204C, and is equipped to manage the complexities of high-speed serial data transfers reliably. Its design focuses on minimizing latency and ensuring precise synchronization, crucial for applications involving multiple converters. The IP's adaptability across various FPGA platforms makes it a critical component for high-bandwidth data acquisition systems prevalent in industries like communications and advanced instrumentation.
This series of TCP/UDP offload engines from Intilop is engineered to support an impressive range of session handling capabilities - with the capacity for over 1000 sessions. Tailored for high-performance network applications, this series maintains the hallmark of ultra-low latency offloading, significantly reducing the processing load on the host CPU. By effectively offloading TCP and UDP protocols, these engines facilitate faster data processing and transfer rates, which are crucial for real-time applications and demanding network environments. They are particularly beneficial for systems requiring high throughput and low power consumption, such as large enterprise networks and high-frequency trading systems. The series integrates seamlessly into existing FPGA setups, enabling designers to leverage its robust architecture for enhanced performance. Each engine in this series ensures consistent high-speed data handling, which maximizes network bandwidth usage and reduces overall system costs.
The Die-to-Die (2.5D/3D) Interface at Global Unichip Corp. is pivotal for managing inter-die communication in integrated circuits. It serves high-performance computing and AI applications, enabling efficient data communication across various dies within an integrated system. Its design helps in minimizing latency and maximizing bandwidth, critical for modern computation-intensive tasks. This interface supports advanced packaging solutions, providing extensive variability in system design, from simple to complex structures. It aligns with various semiconductor nodes, ensuring compatibility and flexibility for different technological requirements. The interface is equipped to handle the demanding needs of modern processors and computing architectures. With a focus on thermal performance, the Die-to-Die Interface is engineered to support efficient heat dissipation, a critical need in high-density computing environments. Its robust design facilitates easier integration into a variety of system configurations, supporting the next wave of high-performance semiconductor advancements.
Join the world's most advanced semiconductor IP marketplace!
It's free, and you'll get all the tools you need to discover IP, meet vendors and manage your IP workflow!
No credit card or payment details required.
Join the world's most advanced AI-powered semiconductor IP marketplace!
It's free, and you'll get all the tools you need to advertise and discover semiconductor IP, keep up-to-date with the latest semiconductor news and more!
Plus we'll send you our free weekly report on the semiconductor industry and the latest IP launches!