Chip Talk > AI Boom Drives TSMC's CoPoS Mass Production Vision with NVIDIA as Key Client
Published June 11, 2025
The relentless advancement in AI technologies has not only pushed the boundaries of computing power but has also prompted semiconductor giants to evolve their manufacturing processes. One such evolution is currently unfolding with TSMC's ambitious plunge into CoPoS (Chip-on-Panel-on-Substrate) technology, setting a target for mass production by 2029. This article delves into what CoPoS entails, why it's a game-changer, and how TSMC is positioning itself with strategic collaborations, particularly with NVIDIA.
CoPoS, or Chip-on-Panel-on-Substrate, is an advanced packaging technology that marks a significant departure from traditional chip manufacturing methods. It builds on the foundations laid by CoWoS-L and CoWoS-R technologies used for high-performance applications. The critical innovation in CoPoS is the shift from a circular wafer to a rectangular substrate measuring 310x310mm. This change is not just aesthetic; it offers substantial technical benefits, such as increased usable substrate area, which in turn enhances output efficiency and reduces costs.
TSMC, renowned for its cutting-edge semiconductor technology, is betting big on CoPoS to meet the growing demands of AI-driven applications. According to TrendForce, the company's facilities in Chiayi, specifically the AP7 site, are being developed to spearhead this advanced packaging strategy. The AP7 campus is slated to undergo a phased development, with CoPoS initiatives rolling out in phase 4, highlighting TSMC's methodical approach to scaling its operations.
NVIDIA, a leader in AI technology and innovation, seems to be the first in line to harness the potential of CoPoS. The collaboration between TSMC and NVIDIA underscores the latter's commitment to pushing the envelope in AI and high-performance computing. The move aligns with NVIDIA's strategic roadmap, which involves integrating cutting-edge silicon technologies to power its advanced computing platforms.
The introduction of CoPoS by TSMC is not just a technological leap but also a strategic maneuver to stay ahead in the semiconductor industry's competitive landscape. The ability to produce more efficient chips at a lower cost not only benefits TSMC and its direct partners like NVIDIA but also sets a new benchmark for the industry.
Moreover, TSMC's strategy to diversify its manufacturing and packaging processes to separate campuses, such as AP7 for CoPoS and AP8 for CoWoS, speaks to its broader vision of specialization and efficiency.
In summary, as the demand for AI applications skyrockets, technologies like CoPoS are paving the way for next-generation semiconductor solutions. TSMC's forward-thinking strategy, coupled with its collaboration with industry giants like NVIDIA, positions it as a key player in this evolving landscape. As we approach the targeted mass production year of 2029, it will be intriguing to see how CoPoS and similar innovations shape the future of electronic design and manufacturing.
For more in-depth insights, refer to MoneyDJ and Economic Daily News reports.
Join the world's most advanced semiconductor IP marketplace!
It's free, and you'll get all the tools you need to discover IP, meet vendors and manage your IP workflow!
Join the world's most advanced AI-powered semiconductor IP marketplace!
It's free, and you'll get all the tools you need to advertise and discover semiconductor IP, keep up-to-date with the latest semiconductor news and more!
Plus we'll send you our free weekly report on the semiconductor industry and the latest IP launches!
