Chip Talk > AIXTRON's MOCVD Tech Boosts SMART Photonics Opportunities
Published May 06, 2025
As industries demand more efficient integration of electronics, AIXTRON's recent delivery of a new MOCVD system to SMART Photonics marks a significant leap forward in photonic integrated circuit (PIC) production. These cutting-edge devices find applications across telecommunications, healthcare, and other sectors that demand high precision and integration of complex photonic functions.
AIXTRON's G10-AsP system addresses the need for high-volume production of indium phosphide (InP) based PICs, especially important as the demand for 5G, AI, and advanced sensing increases globally. According to market predictions, the PIC industry could see a compound annual growth rate (CAGR) of 14% from $3 billion in 2023 to even higher by 2027, driven by this high-demand telecommunications sector. The system delivered will enable SMART Photonics to scale up operations while maintaining or even improving production quality, thanks to superior on-wafer uniformity and automated processes for stability.
For SMART Photonics, which operates in a collaborative environment with Eindhoven University, the enhanced capacity enabled by AIXTRON's MOCVD system allows the company to keep pace with rapid technological advancements. AIXTRON's newest system provides precise control over epitaxial layers crucial for the high-speed computing capabilities needed in modern telecommunication.
Moreover, decreased thermal stress and increased temperature control are significant improvements over previous generations, which will likely lead to better yield rates and lower production costs. Felix Grawert, CEO of AIXTRON, noted the importance of this technology in cutting down on product development lead-times, thereby getting to market faster.
The production of PICs that integrate light emissions directly on chips offers seismic shifts in data processing capability, enabling faster processing speeds and reduced power losses, which are crucial benefits for expanding telecommunications infrastructure. AIXTRON's system addresses these needs with a focus on uniformity and reduced thermal footprints that satisfy both operational and environmental benchmarks.
For companies like smart photonics, this means they can now push the boundaries of photonic integration and create more compact, efficient, and powerful devices. This could potentially enable the next wave of telecommunications technologies, including smart antennas and more efficient data center operations.
As industries globally pivot towards higher efficiency and sustainability, the collaboration between AIXTRON and SMART Photonics sets the stage for new capabilities in the photonics sector, enhancing both product quality and operational scalability. Such technological advancements highlight how more efficient semiconductor manufacturing technologies can drive profound changes across industries dependent on fast, reliable data communication.
In a world increasingly dependent on high speed connectivity and data processing, AIXTRON's technological competence in MOCVD systems positions them as a leader responding adeptly to such global megatrends while setting a foundation for the next innovations in telecommunications and beyond. For more details on this technological milestone, explore here.
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