Chip Talk > Charting New Horizons in Space: NEXT Semiconductor's Collaboration with BAE Systems
Published April 28, 2025
Space exploration demands robust and innovative solutions, prompting NEXT Semiconductor Technologies to team up with BAE Systems. This collaboration focuses on enhancing ultra-wideband antenna processor units (APUs) for future space missions, pushing the frontier of radiation-hardened electronics essential for satellites.
One of the standout developments from this collaboration is the NX450, a groundbreaking antenna processor, boasting an impressive 200 GS/s sampling rate and 100-GHz RF bandwidth across multiple channels. This advancement simplifies sensor design, advancing electronic warfare capabilities while minimizing size, weight, and power requirements.
By leveraging the expertise of semiconductor fabs like GlobalFoundries, NEXT is steering the development of System-on-Chip (SoC) solutions that enhance satellite communication, a sector experiencing surging demand due to the proliferation of satellite networks.
Jim LaRosa from BAE Systems stresses the importance of merging their decade-spanning space electronics expertise with NEXT's cutting-edge SoC solutions. This partnership aims to deliver products capable of performing in the severe conditions of space environments—a key differentiator in the competitive landscape of satellite communications.
With space applications growing more sophisticated each year, collaboration efforts like these between NEXT and BAE Systems are pivotal. This partnership not only sets new benchmarks in satellite tech but also propels the semiconductor IP sector into previously uncharted territory, as highlighted in Semiconductor Digest.
Rating: 9: This collaboration is pivotal for semiconductor professionals involved in space technology, offering insights into cutting-edge applications and reinforcement of space-bound technologies.
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