Chip Talk > Google Rethinks HBM Collaborations Amid Supply Chain Challenges
Published April 25, 2025
In an unexpected move, Google has decided to alter its strategy for high bandwidth memory (HBM) by reconsidering its collaboration with Samsung on HBM3E chips. This development comes as Samsung faces challenges in the HBM3E certification, prompting Google to pause its plans to partner with Samsung for use in AI server chips. The industry is now watching how this shift might influence the landscape of AI memory and compute.
For semiconductor IP professionals, this move could hint at shifting alliances in the HBM space, as well as potential realignments in strategic partnerships. With AI server demand forecasting rapid growth, securing a reliable HBM supply chain is a keynote strategic consideration for firms aiming to stay competitive in this dynamic market. As such IP experts working in this field, keeping an eye on evolving partnerships and certification progress will be key.
To read more on this issue, check out the full article on Digitimes.
Join the world's most advanced semiconductor IP marketplace!
It's free, and you'll get all the tools you need to discover IP, meet vendors and manage your IP workflow!
No credit card or payment details required.
Join the world's most advanced AI-powered semiconductor IP marketplace!
It's free, and you'll get all the tools you need to advertise and discover semiconductor IP, keep up-to-date with the latest semiconductor news and more!
Plus we'll send you our free weekly report on the semiconductor industry and the latest IP launches!