Chip Talk > Huawei and SMIC's Journey through US Sanctions to Reach the 5-nm Horizon
Published June 24, 2025
In the ever-evolving world of semiconductor technology, Chinese tech giant Huawei and Semiconductor Manufacturing International Corporation (SMIC) find themselves embroiled in a complex struggle to leap the 5-nanometre (nm) manufacturing process hurdle. This quest is heavily shrouded in political and technological challenges, set against the backdrop of US-imposed sanctions.
Huawei's predicament is not new but gradually reaches new heights as technological advancements in the semiconductor space prove elusive. The problems stem primarily from an entanglement of geopolitical and technological challenges. US sanctions continue to impede Huawei’s access to cutting-edge equipment essential for 5-nm chip production, which are predominantly controlled by US interests.
SMIC has been Huawei's lifeline, but even as China's largest contract chipmaker, it struggles to meet the 5-nm standard without key technologies from the US. TechInsights recently highlighted that Huawei's latest attempt to penetrate this technology level came up short with its MateBook Fold Ultimate Design laptop, which incorporates a 7-nm chip, rather than the latest 5-nm standard.
The technological ramifications of these constraints are profound. While Huawei remains a key player in telecommunications and consumer electronics, being multiple generations behind rivals like Apple and its 3-nm-fueled M-series chips from Taiwan Semiconductor Manufacturing Company (TSMC) puts Huawei at a competitive disadvantage.
The sanctions have served to not only slow Huawei’s technological progression but have also created openings in the market for Western companies to maintain a lead in cutting-edge chip manufacturing technologies. For instance, Apple's continuous collaboration with TSMC allows it to harness some of the industry's most advanced technologies, thereby solidifying its market leadership.
In response to the monumental challenges posed by these sanctions, Huawei has pursued innovations in other areas. Emphasizing its proprietary HarmonyOS for its devices showcases its strategic pivot toward self-reliance, not only in hardware but also in the software ecosystem. This could be a hedge against future technological isolation but is a long road before it can replace the cutting-edge capabilities lost due to technological embargoes.
Looking forward, Huawei and SMIC are left grappling with alternatives to circumvent these hurdles. Part of their strategic response involves investing heavily in research and development to foster indigenous innovation ecosystems that could eventually produce competitive alternatives to Western technologies.
However, the question remains: how quickly can Huawei scale these efforts to regain its competitive edge in an industry dominated by leaders like TSMC and Intel?
In this landscape riddled with geopolitical and technological challenges, Huawei's experience serves as a case study for other nations striving for semiconductor sovereignty. As countries reassess their semiconductor strategies, the actions taken by Huawei could inform broader initiatives to mitigate similar vulnerabilities. Thus, in the rapidly shifting sands of technology and policy, Huawei and SMIC's journey through US sanctions offers insight and foresight into the future of global semiconductor competition.
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