Chip Talk > Innovative Cooling Tech from Tokyo University Sets New Standards
Published April 25, 2025
As semiconductor devices continue to shrink in size and increase in performance, efficient thermal management becomes more critical. The University of Tokyo's latest research introduces a groundbreaking cooling solution that leverages phase change to dramatically improve heat dissipation. By using 3D microfluidic channels, this system achieves a coefficient of performance (COP) that is ten times higher than traditional cooling methods. This innovation could be game-changing for the industry, offering compact and effective solutions for heat management without resorting to expensive materials.
This development, promising to benefit areas like HPC and aerospace, highlights the ongoing importance of innovation in thermal solutions for semiconductors.
Explore the details of the study on Trendforce.
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