During the 2025 Shanghai Auto Show, Intel announced collaborations with several leading Asian semiconductor firms—Black Sesame Technologies, Model Best, and BOS Semiconductors—to advance AI in automotive applications. According to Trendforce, these partnerships aim to surmount technological obstacles in smart vehicle ecosystems.

With Black Sesame, Intel is developing an integrated cockpit-driving platform that leverages both companies' technological strengths, while its collaboration with Model Best focuses on creating a pure-edge intelligent in-vehicle cockpit. Meanwhile, work with BOS Semiconductors centers on boosting AI performance in driver-assistance systems.

These initiatives highlight a growing trend of cross-border partnerships to foster innovation, offering semiconductor professionals insight into future development paths for AI in automotive applications. Such collaborations not only push technological boundaries but also suggest strategic wins for companies capable of forming strong international alliances.

As Intel strengthens its AI offerings in the automotive space, the implications for semiconductor IP development and tech innovation strategies are immense, potentially redefining future opportunities and competition.