Chip Talk > Microchip Advances Edge AI with High-Density Power Module
Published April 25, 2025
In a significant move to support AI at the edge, Microchip Technology has introduced the MCPF1412 power module. This compact, high-density module is tailored for industrial automation and data center applications, delivering robust power management solutions with a minimal footprint.
The MCPF1412 is equipped with a 16V VIN buck converter and supports I2C and PMBus interfaces, offering efficient power conversion. By reducing chip placements on boards by 40%, this innovation highlights the continued trend towards integrating more advanced technologies into increasingly compact areas, a key aspect in the evolution of semiconductor design for AI applications.
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