In a groundbreaking development, OKI Circuit Technology has succeeded in creating a 124-layer PCB technology. Targeted at advancing semiconductor testing equipment, this innovation signifies a considerable enhancement over the existing 108-layer designs.

This technology caters to the needs of high-bandwidth memory used in AI semiconductors, where quick and efficient data transmission is vital. By introducing ultra-thin materials and automated systems specifically designed for such modalities, OKI is leading the charge in accommodating the next-gen demands of AI processing.

The substantial increase in layers on a PCB, while keeping its thickness unchanged, allows for higher density and performance without sacrificing the physical limitations set by conventional PCB designs. The strategic focus on AI semiconductors and other futuristic undertakings underscores the necessity for these advancements.

Expect mass production of this technology to roll out by 2025, as OKI pushes forward with its comprehensive electronics manufacturing services. With these developments, OKI positions itself at the forefront of technological progress in the PCBs used for AI and beyond.

Catch more details as OKI showcases this technology at PCB East 2025.