In a move that is likely to significant impact semiconductor packaging, particularly in the high bandwidth memory (HBM) sector, SK hynix has initiated diversification from its longstanding equipment supplier, Hanmi Semiconductor. The motivation behind this shift, according to TrendForce, is reportedly linked to the advent of hybrid bonding technology.

Hybrid bonding, unlike traditional TC bonding, directly connects chips without the intermediary bumps leading to thinner stacks and improved performance in HBM products. As traditional TC bonding faces challenges with yield at higher layers like the 16Hi stacks, hybrid bonding proposes a future-proof alternative.

This technological shift is not only playing a role in recent equipment disputes but could also reshape competitive dynamics in the DRAM industry. SK hynix's proactive stance in exploring alternatives, including ASMPT's equipment, underscores the potential advantages seen in hybrid bonding for next-gen HBM stacks.

Moreover, with others like Samsung also venturing into hybrid bonding for its 12-layer HBM4 development, the industry is keenly observing how these advancements might influence both market dynamics and technological standards in semiconductor manufacturing.