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Blue Cheetah Analog Design, Inc.

Blue Cheetah Analog Design, Inc. is a pioneering semiconductor IP provider, renowned for its advanced chiplet interconnectivity solutions. The company specializes in delivering area and power-efficient interconnect IP designed specifically for unique chiplet requirements across diverse packaging applications. Central to their offerings is the BlueLynx technology, which provides physical and link layer interfaces tailored for both advanced and standardized packaging scenarios, supporting frameworks such as the Open Compute Project's Bunch of Wires (BoW) and Universal Chiplet Interconnect Express (UCIe). As a company that champions customized, standards-based solutions, Blue Cheetah empowers chipmakers to optimize their architecture and design processes by offering unparalleled customization potential, facilitating rapid design cycles, and mitigating potential developmental risks. With a focus on applications in AI, high-performance computing, and mobile markets, Blue Cheetah remains at the forefront by supporting a variety of advanced packaging methods and maintaining industry-leading power, performance, and area (PPA) benchmarks. The company is headquartered in Sunnyvale, California, and plays a crucial role in propelling new innovations in semiconductor design and integration. Read more

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BlueLynx Chiplet Interconnect

The BlueLynx Chiplet Interconnect system provides an advanced die-to-die connectivity solution designed to meet the demanding needs of diverse packaging configurations. This interconnect solution stands out for its compliance with recognized industry standards like UCIe and BoW, while offering unparalleled customization to fit specific applications and workloads. By enabling seamless connection to on-die buses and Networks-on-Chip (NoCs) through standards such as AMBA, AXI, ACE, and CHI, BlueLynx facilitates faster and cost-effective integration processes. The BlueLynx system is distinguished by its adaptive architecture that maximizes silicon utilization, ensuring high bandwidth along with low latency and power efficiency. Designed for scalability, the system supports a remarkable range of data rates from 2 to 40+ Gb/s, with an impressive bandwidth density of 15+ Tbps/mm. It also provides support for multiple serialization and deserialization ratios, ensuring flexibility for various packaging methods, from 2D to 3D applications. Compatible with numerous process nodes, including today’s most advanced nodes like 3nm and 4nm, BlueLynx offers a progressive pathway for chiplet designers aiming to streamline transitions from traditional SoCs to advanced chiplet architectures.

Blue Cheetah Analog Design, Inc.
GLOBALFOUNDRIES, TSMC
10nm, 20nm, 28nm, 65nm, 90nm, 90nm S90LN
AMBA AHB / APB/ AXI, Analog Front Ends, Clock Synthesizer, D2D, Gen-Z, IEEE1588, Interlaken, MIPI, Modulation/Demodulation, Network on Chip, PCI, PLL, Processor Core Independent, VESA, VGA
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