Eliyan

Eliyan is pushing the boundaries of semiconductor technology with its innovative chiplet interconnect solutions, designed to enhance the performance of AI by eliminating the traditional limitations known as the 'Memory Wall.' Their proprietary PHY technology, NuLink, facilitates the creation of super large System-in-Packages (SiPs) using standard packaging, resulting in significant improvements in AI performance, power efficiency, and size. By leveraging this technology, Eliyan aims to make multi-die approaches more appealing to chip manufacturers who need to optimize both power and bandwidth. Read more

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Foundry

NuLink Die-to-Die PHY for Standard Packaging

Eliyan's NuLink Die-to-Die (D2D) PHY products are designed to provide high-performance, low-power connectivity between chips, or 'chiplets,' in a system. Using standard organic laminate packaging, these IP cores maintain power and performance levels that would traditionally require advanced packaging techniques like silicon interposers. This eliminates the need for such technology, allowing cost-effective system design and reducing thermal, test, and production challenges while maintaining performance. Eliyan’s approach enables flexibility, allowing a broad substrate area that supports more chiplets in the package, significantly boosting performance and power metrics. These D2D PHY cores accommodate various industry standards, including UCIe and BoW, providing configurations tailor-made for optimal bump map layout, thus enhancing overall system efficiency.

Eliyan

Intel Foundry, TSMC

7nm

AMBA AHB / APB/ AXI, CXL, D2D, MIPI, Network on Chip, Processor Core Dependent, V-by-One

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NuLink Die-to-Memory PHY Products

The NuLink Die-to-Memory (D2M) PHY products from Eliyan provide a robust solution for memory-intensive applications, offering high bandwidth and low power consumption. This technology stands out by providing a dynamic communication link devoid of the constraints of fixed unidirectional die-to-die architectures. Utilizing a bidirectional approach, it supports greater efficiency and performance. D2M PHY products are pivotal in scenarios where a substantial separation is necessary between heat-sensitive memory and high-power ASICs, optimizing thermal management and power distribution across the package. The bidirectional design enhances flexibility and scalability, allowing seamless adaptation to different die configurations required for evolving technological demands.

Eliyan

Intel Foundry, TSMC

7nm

Flash Controller, SDRAM Controller

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