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EXTOLL GmbH

EXTOLL GmbH is a pioneering force in the semiconductor IP industry, dedicated to crafting high-speed interconnect solutions that redefine the landscape of chip technology. The company thrives on innovation, as it continuously integrates the latest advancements to deliver IPs with the lowest power consumption. With a unique digital-centric architecture, EXTOLL not only enhances SerDes interconnects but also spearheads sophisticated solutions like the UCIe for systems that leverage chiplets in heterogeneously integrated environments. The company's groundbreaking products—including SerDes, UCIe, and NOC—are pivotal to the future of chiplet-based technology. These technologies are engineered to be ultra-efficient, both in power and cost, while maintaining scalability and speed. With compatibility spanning mainstream process nodes from 12nm to 28nm, EXTOLL's offerings empower customers to construct faster and more energy-efficient systems. At its core, EXTOLL is driven by a team of experts who are passionate about making a significant impact in the semiconductor market. This collective expertise fuels their mission to develop cutting-edge interconnect technologies, helping clients achieve their technical ambitions by building systems that are not just efficient, but also sustainable and scalable. Read more

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24
IPs available

Universal Chiplet Interconnect Express (UCIe)

Universal Chiplet Interconnect Express, or UCIe, is a forward-looking interconnect technology that enables high-speed data exchanges between various chiplets. Developed to support a modular approach in chip design, UCIe enhances flexibility and scalability, allowing manufacturers to tailor systems to specific needs by integrating multiple functions into a single package. The architecture of UCIe facilitates seamless data communication, crucial in achieving high-performance levels in integrated circuits. It is designed to support multiple configurations and implementations, ensuring compatibility across different designs and maximizing interoperability. UCIe is pivotal in advancing the chiplet strategy, which is becoming increasingly important as devices require more complex and diverse functionalities. By enabling efficient and quick interchip communication, UCIe supports innovation in the semiconductor field, paving the way for the development of highly efficient and sophisticated systems.

EXTOLL GmbH
GLOBALFOUNDRIES, Samsung, TSMC, UMC
22nm, 28nm
AMBA AHB / APB/ AXI, D2D, Gen-Z, Multiprocessor / DSP, Network on Chip, Processor Core Independent, USB, V-by-One, VESA
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High-Speed SerDes for Chiplets

High-Speed SerDes for Chiplets is engineered to provide exceptional interconnect solutions tailored for chiplet architectures. This product offers ultra-low power consumption while maintaining high data transfer rates, essential for modern multi-die systems. By facilitating rapid communication between chiplets, it enhances overall system efficiency and performance. This SerDes solution is optimized for integration with a range of tech nodes, ensuring compatibility with various semiconductor manufacturing processes. Its design is focused on providing robust data integrity and reducing latency, which are crucial for efficient system operation in complex, integrated circuits. High-Speed SerDes addresses the growing demand for advanced interconnect solutions in chiplet architectures, making it an indispensable tool for developing next-generation semiconductor devices. Its ability to support high data throughput while keeping power use minimal makes it a standout choice in high-performance design environments.

EXTOLL GmbH
GLOBALFOUNDRIES, Samsung, TSMC, UMC
22nm, 28nm
AMBA AHB / APB/ AXI, D2D, Ethernet, MIL-STD-1553, Network on Chip, Optical/Telecom
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Network on Chip (NOC-X)

Network on Chip X, or NOC-X, is an advanced solution that facilitates communication within a chip by integrating multiple processor cores and IP blocks through a high-performance data transmission network. This IP is specifically crafted to optimize on-chip data flow, ensuring that information can be swiftly and efficiently routed to where it's needed, even in the most demanding computational environments. The NOC-X is built to support a variety of configurations, making it an adaptable choice for different semiconductor designs. It enhances system throughput while maintaining low power consumption, crucial for modern electronic devices requiring both high-speed processing and energy efficiency. By leveraging the capabilities of NOC-X, system designers can achieve superior design flexibility, accelerating the development of complex systems with multiple processing demands. This IP thus plays a role in pushing the boundaries of what’s possible in semiconductor innovation, contributing to the efficiency and performance of future technology solutions.

EXTOLL GmbH
GLOBALFOUNDRIES, Samsung, TSMC, UMC
22nm, 28nm
Network on Chip, Processor Core Independent
View Details
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