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InnoSilicon Technology Ltd.

InnoSilicon Technology Ltd. is a distinguished semiconductor IP company renowned for its comprehensive portfolio of advanced IP solutions. The company is a leader in providing high-speed interface PHY and controller IPs, as well as cutting-edge multimedia and custom IP solutions, catering to a vast range of industries. InnoSilicon has made significant strides in chiplet technology, offering high-performance interconnect solutions for chip-to-chip and die-to-die communication, enabling the future of heterogeneous system integration. They firmly position themselves as a provider that not only delivers proven and reliable IP but also optimizes these technologies for emerging markets like 5G communication, automotive industry, and IoT, adapting to the rapid needs of a growing data-centric world. Their capability extends through providing fully customizable and high-performance solutions that meet specific customer needs, offering a unique blend of superior quality, affordability, and scalability in IP deployment. Read more

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24
IPs available

56G SerDes Solution

InnoSilicon's 56G SerDes Solution caters to the high-speed data transfer needs of today's semiconductor industry, offering a robust and flexible platform for a variety of high-bandwidth applications. This SerDes solution provides a comprehensive interface for seamless integration in networking and communication systems, including PCIe, USB, and Ethernet. Engineered for performance, the 56G SerDes boasts multi-protocol support, which allows for versatility in system design. It offers unmatched signal integrity, optimizing data rate speeds across various environments while minimizing electromagnetic interference. This ensures reliable communication channels capable of handling the complexities of modern digital data transfer. The solution's adaptability to different process nodes enhances its utility in diverse technological settings, promoting efficiency and reducing power consumption. It is especially suited for use in data centers, telecommunications infrastructure, and other areas where high-speed data processing is required. Through its advanced modulation techniques and streamlined architecture, the 56G SerDes Solution provides a valuable foundation for building next-generation networking solutions.

InnoSilicon Technology Ltd.
GLOBALFOUNDRIES, HHGrace, Intel Foundry
16nm, 22nm, Intel 3
AMBA AHB / APB/ AXI, ATM / Utopia, D2D, Ethernet, Fibre Channel, IEEE1588, Interlaken, PCI, RapidIO, SAS, USB
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GDDR7 PHY and Controller

The GDDR7 PHY and Controller is designed to deliver superior memory bandwidth, ideal for high-performance applications such as gaming and data centers. With support for speeds from 20Gbps to 36Gbps, this memory architecture provides flexibility and robust performance for graphics-intensive operations, enabling seamless data transfer and efficient power consumption. The GDDR7 solution integrates advanced techniques to minimize latency and optimize data throughput, ensuring that users can enjoy high-resolution visuals and responsive computing experiences without compromise. This sophisticated IP effectively supports multiple generations of GDDR memory technologies, offering backward compatibility that ensures a smooth transition for designers migrating from previous platforms. Its scalable architecture provides future-proofing for emerging requirements in AI, machine learning, and high-performance computing applications. By leveraging advanced process nodes, the GDDR7 PHY and Controller enhances power efficiency and operational efficiency, perfectly aligning with the needs of data-rich environments. The controller is equipped with industry-leading signal integrity and energy efficiency features, making it suitable for integration in advanced computing systems. This ensures not only enhanced performance but also delivers on cost efficiency, making it a preferred choice for designers looking to push the limits of graphics technology without inflating production costs.

InnoSilicon Technology Ltd.
TSMC
10nm, 12nm, Intel 3
DDR, Flash Controller, HBM, SDRAM Controller
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UCIe Chiplet Interconnect

The UCIe Chiplet Interconnect is an advanced solution facilitating unparalleled communication across chiplets, ensuring efficient system scalability and integration. This interconnect standard supports high data rates ranging from 24Gbps to 32Gbps, making it essential for cutting-edge multi-chip module (MCM) designs and System in Package (SiP) technologies. Designed with flexibility, it bridges various interfaces such as AXI and CHI, providing designers with versatile options for high-throughput interconnection across different silicon pieces. Its architecture supports both die-to-die and chip-to-chip communications, essential for modern heterogeneous applications that require diverse functionalities within a compact system footprint. InnoSilicon’s UCIe solution promotes seamless data exchange and minimizes bottlenecks, improving the efficiency of systems relying heavily on parallel processing and large data transfers. This technology plays a critical role in the rapid prototyping and mass production of high-performance computing systems and AI-powered devices. Supporting current and future process nodes, the UCIe Chiplet Interconnect ensures adaptability and relevance in an evolving semiconductor landscape, contributing to the growing demand for modular and customizable semiconductor infrastructure.

InnoSilicon Technology Ltd.
Intel Foundry, TSMC
28nm, 55nm, Intel 20A
AMBA AHB / APB/ AXI, D2D, Gen-Z, Network on Chip, PCI, PCMCIA, USB, WMA
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HBM3E/4 PHY and Controller

Geared towards ultra-high bandwidth demands, the HBM3E/4 PHY and Controller facilitates efficient high-throughput data management essential for high-computing applications, from AI to large data analytics. This high-bandwidth memory solution supports speeds of up to 9.6Gbps, providing the cornerstone for robust data center infrastructure and cutting-edge AI systems. The HBM3E/4 solution integrates seamlessly with existing architectures, offering designers a flexible framework that encourages architectural innovation and performance scaling. Its low power consumption and reduced latency fundamentally enhance overall system cost-efficiency, avoiding bottleneck scenarios in data-intensive applications. By supporting sophisticated memory architectures across various process nodes, this IP solution demonstrates versatility and robust compatibility with industry standards. Ideal for next-generation computing platforms, the HBM3E/4 enables users to implement performance-critical applications with confidence, backed by InnoSilicon’s comprehensive support and adaptation to future technology trends.

InnoSilicon Technology Ltd.
GLOBALFOUNDRIES, Samsung, TSMC
3nm, 55nm, Intel 18A
HBM, Oscillator
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LPDDR5/5X/4/4X PHY and Controller

Tailored for a variety of applications from mobile to automotive, the LPDDR5/5X/4/4X PHY and Controller supports high-speed, low-power memory interfaces perfect for today's advanced systems. Its capability to operate at higher data rates while maintaining low power consumption makes it ideal for mobile and low-power applications. The solution provides compatibility with multiple generations of LPDDR technology, offering flexibility and ensuring smooth transitions for device manufacturers. Leveraging advanced power management features, it significantly enhances battery life in portable devices, contributing to better user experiences. Engineered to integrate seamlessly into diverse architectures, this PHY and Controller supports scalable performance, making it suitable for applications that require significant amounts of data processing. It addresses industry demands for higher performance with greater energy efficiency and can be adapted to future technological advancements easily, making it a key component in the development of next-generation applications.

InnoSilicon Technology Ltd.
GLOBALFOUNDRIES, Intel Foundry, VIS
7nm, 14nm, 22nm
Mobile DDR Controller, Mobile SDR Controller
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GDDR6X/6 PHY and Controller

The GDDR6X/6 PHY and Controller targets high-bandwidth memory applications, perfect for data-intensive environments like gaming graphics and data centers. With support for GDDR6 and GDDR6X standards, it offers enhanced data rates, increasing system performance through improved memory throughput. This solution incorporates advanced features that optimize power, performance, and area, contributing significantly to efficiency improvements in demanding applications. It facilitates seamless integration with existing system architectures, offering scalable performance tailored to meet the evolving needs of graphics engines and AI workloads. Engineered to provide high speed and robust performance, the GDDR6X/6 Controller meets the needs of cutting-edge graphics applications, supporting bandwidth demands while maintaining low power consumption. By leveraging the latest advancements in semiconductor technology, it supports diverse process nodes, ensuring a future-proof memory controller platform capable of handling tomorrow's data demands today.

InnoSilicon Technology Ltd.
TSMC
All Process Nodes, 10nm, 12nm
DDR, eMMC, SDRAM Controller
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MCR-DDR5/DDR5/DDR4

The MCR-DDR5/DDR5/DDR4 solution is designed to bridge the gap between high-speed data transfer and efficient power management, targeting modern computing applications that require substantial data movement with energy efficiency. By supporting both DDR4 and DDR5 standards, this IP provides tremendous flexibility for designers aiming to leverage current and emerging DRAM technologies. Featuring advanced signal integrity features, this solution ensures robust data transmission, reducing potential errors and enhancing overall system reliability. Its scalable architecture allows customization, making it suitable for a range of applications—from data centers to AI deployments—where speed and efficiency are paramount. Compatible across various process nodes, the MCR-DDR5/DDR5/DDR4 offers designers a platform that can evolve with changing technology trends. The incorporation of power-efficient techniques enhances the IP’s viability in systems where energy consumption is a critical factor, supporting a sustainable approach to high-performance computing development.

InnoSilicon Technology Ltd.
GLOBALFOUNDRIES, Samsung, TSMC
11nm FinFET, 14nm, 40nm
DDR, SDRAM Controller
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DDR3/4/LPDDR3/4/4X

The DDR3/4 and LPDDR3/4/4X memory solutions by InnoSilicon focus on providing a high-performance, energy-efficient memory interface for a variety of applications ranging from mobile to enterprise servers. This IP supports multi-speed configurations, allowing seamless adaptability to different system needs. Equipped with advanced techniques for power saving, it maximizes energy efficiency while maintaining high data rates, ideal for applications where battery life and thermal management are vital. The solution spans various process nodes, enabling flexibility for implementation in both established and emerging technologies. Offering superior compatibility with LPDDR and DDR standards, it reduces time-to-market for designers seeking to integrate mature, stable systems into innovative product lines. With robust reliability and comprehensive design support, the DDR3/4 and LPDDR3/4/4X IP solutions appeal strongly to developers looking to balance efficiency with cutting-edge performance.

InnoSilicon Technology Ltd.
SMIC, TSMC, UMC
12nm LP/LP+, 130nm, 150nm
DDR, Mobile DDR Controller, SDRAM Controller
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