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SkyeChip's Coherent Network-on-Chip (NOC) is expertly designed to manage the complexities of memory-coherent systems, allowing for scalable and area-efficient interconnect solutions. It utilizes protocols like ACE and CHI to ensure seamless data coherency across components, reducing routing congestion in sophisticated many-core processing environments. The Coherent NOC integrates with SkyeChip's Home Agent and supports interchangeable coherency handlers, which helps maintain data consistency efficiently. Operating at up to 2GHz, it supports synchronous clocking topologies, facilitating high-speed communications within and between chip components. Its adaptability makes it suitable for the latest packaging technologies, enhancing high-speed data transfer and system coherency across multi-die arrangements.
SkyeChip's Non-Coherent Network-on-Chip (NOC) offers a performance-driven solution designed to optimize bandwidth and latency across silicon components. By minimizing wire utilization, it allows for power-efficient IC layouts, making it particularly valuable for complex chip architectures requiring robust interconnectivity. The NOC supports a range of node protocols, including AXI4 and AXI-Stream, and is engineered to facilitate seamless integration with SkyeChip's Coherent NOC for more extensive system partitioning. This NOC variant is capable of operating at frequencies up to 2GHz, accommodating high-frequency clocking topologies for source-synchronous environments. Its advanced interconnect capabilities enable efficient data bridges between 2.5D and 3D die configurations, thus supporting cutting-edge packaging innovations essential in modern electronic designs.
The HBM3 PHY and Memory Controller is a highly optimized solution designed to meet the demanding needs of AI, HPC, data centers, and networking applications. Conforming to the HBM3 (JESD238A) JEDEC standards, this IP solution combines PHY and controller elements for a streamlined memory interface. It supports high data rates, with capabilities up to 6400 MT/s for HBM3 and up to 9600 MT/s for HBM3E, ensuring robust performance under intensive computational loads. The architecture is built to offer flexibility, accommodating multiple densities and DRAM stack configurations, while also supporting 2.5D and 3D packaging technologies. Advanced features such as a DFI 5.1 compatible interface and options for debug, MPFE, and RAS enhance the operational efficiency and manageability of memory systems.
SkyeChip's Bandgap represents an essential voltage reference solution, designed to provide a stable output across varying temperatures and load conditions. With an output voltage of 0.9V and a current tolerance of +/- 10%, this bandgap reference is ideal for precision circuits that demand consistent performance. Operating efficiently within a wide temperature range from -40°C to 125°C, the Bandgap's robust design ensures stability and reliability even in harsh environments, while consuming less than 500 µW of power. This makes it an excellent choice for embedded systems and low-power applications where maintaining power efficiency is critical.
SkyeChip's DDR5/4 PHY and Memory Controller provides a comprehensive, area-efficient, and low-power memory interface solution aligned with JEDEC standards for DDR5 and DDR4 technologies. Tailored for high-performance applications, the IP supports data rates up to 4800 MT/s, with an upgrade path to 6400 MT/s for DDR5. It is engineered to handle typical I/O workloads with receiver decision feedback equalization and transmitter feed-forward equalization, making it ideal for sophisticated memory operations. The controller also accommodates diverse memory architectures including x4, x8, and x16 SDRAMs, with support for extended DDR5 features like 3DS configurations and high-caliber data management linked to LRDIMM, RDIMM, and UDIMM applications, further enhancing its competitive edge.
The High-Speed Phase-Locked Loop (PLL) is a versatile frequency synthesizer designed to accommodate a broad range of applications. Offering a clock frequency range from 100 MHz to 350 MHz, with VCO capabilities extending up to 3.2 GHz, this PLL ensures precise timing synchronization essential for high-speed data communications and processing. By providing output frequencies ranging from 300 MHz to 3.2 GHz, this PLL is ideal for optimizing performance in sophisticated electronic systems, delivering high fidelity and stability across variable operating conditions. Its configurable nature allows for tailored frequency division, supporting both synchronous and source-synchronous setups. Such flexibility and performance make it an indispensable component for enhancing clock system reliability and efficiency in modern digital architectures.
Designed for mobile and low-power applications, the LPDDR5/5X PHY and Memory Controller from SkyeChip offers a high-performance, efficient solution conforming to the JEDEC LPDDR5/5X standards. The solution boasts support for up to 6400 MT/s and even upgrades to 10667 MT/s. This memory controller is particularly suited for mobile devices and portable computing, where power efficiency is crucial. It supports various SDRAM configurations and features extensive flexibility with programmable interfaces, enhancing its adaptability to different use cases. The controller integrates advanced I/O features, including decision feedback equalization and feed-forward equalization, to optimize data handling and transfer rates across its interfaces. Its architecture is finely tuned for reduced power consumption during peak operations, making it a vital component of energy-sensitive applications.
The Die-to-Die (D2D) Interconnect from SkyeChip is a finely-tuned solution engineered to knit together multiple dies in sophisticated electronic systems. Leveraging efficient die-to-die technology, this interconnect supports cutting-edge 2.5D and 3D packaging methods and protocols such as PCIe and CXL, thus catering to diverse communication frameworks across die setups. SkyeChip's D2D Interconnect is designed to foster high-speed communication, supporting data transfers up to 32 Gbps per pin, effectively meeting the demands of high-bandwidth applications. Its lightweight architecture minimizes area and power consumption, contributing to the creation of compact and energy-efficient devices. The solution also incorporates test and repair functionalities to maximize post-packaging yields, cementing its role in high-reliability device manufacturing.
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