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Xpeedic

Xpeedic is a leading provider of electronic design automation (EDA) solutions, specializing in driving innovation from chip to system levels. The company is renowned for accelerating the design processes of high-performing computing chips, memory, and networking products, particularly within data centers. Their comprehensive EDA solutions cater to industries ranging from smart terminals, automotive electronics, to industrial equipment, enhancing both efficiency and intelligence across these platforms. Xpeedic stands out with its robust simulation tools that address critical areas of electronic design, such as signal integrity, power integrity, and electromagnetic compatibility—crucial for creating reliable and high-performance systems. The company’s technology supports complex multi-physics challenges, offering solutions for demanding tasks such as electro-thermal analysis and stress and reliability simulations. Their advanced design platforms and simulation tools also target modern engineering challenges in areas like 3D integrated circuits, chiplet technologies, and radio frequency systems, ensuring that designs meet the highest standards of performance and reliability. By investing in research and collaborating with cutting-edge industries, Xpeedic helps push the boundaries of what is possible in EDA, supporting a wide array of sectors in their quest for technological excellence. Read more

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IPs available

Genesis for Package and PCB Design

Genesis is a comprehensive toolset designed to streamline both package and PCB design processes. This suite includes specialized tools like Genesis XPKG for advanced package design, Genesis XPCB tailored for printed circuit board layouts, and Genesis XLIB for managing device libraries effectively. Additionally, Genesis XSCH supports schematic design for both PKG and PCB, enabling seamless integration and management within complex design environments. With Genesis, users can enhance their design workflows through improved visualization and management of component libraries, effectively reducing time and increasing accuracy in design implementations. The tool also helps in optimizing layout for both performance and manufacturability, ensuring that every design meets both functional and production requirements. Genesis is particularly valuable in environments where detail and accuracy are paramount, providing essential support for complex and high-density designs. It enables designers to push the boundaries of innovation while maintaining compliance with industry standards and performance benchmarks.

Notus for SI/PI/Thermal/Stress Analysis

Notus is an all-encompassing analysis tool focusing on signal integrity (SI), power integrity (PI), thermal and stress simulations. It is engineered to address the intricate challenges faced when designing high-performance electronic systems. Through advanced simulation capabilities, Notus offers a detailed analysis of critical performance parameters, thereby improving design reliability and efficiency. Its robust features allow engineers to simulate and test various stress and thermal conditions, providing insights that help in creating resilient and efficient circuits. The tool is specifically valuable for environments where thermal management and structural analysis are critical. By using Notus, designers can anticipate potential design issues early in the process, allowing for prompt adjustments and avoiding costly design iterations.

IRIS for RF and Analog IC Simulation

IRIS is designed to enable precise and efficient electromagnetic (EM) simulation for radio frequency (RF) and analog integrated circuits (ICs). This tool empowers designers to manage complex design environments and optimize RF and analog designs through accurate simulation capabilities. With IRIS, users have access to cutting-edge simulation technology that significantly reduces design time while improving performance and reliability. Its advanced algorithms and easy-to-use interface facilitate thorough analysis and optimization of IC designs. This simulation tool is essential for engineers focused on high-performance RF and analog designs, providing a reliable platform that addresses both the nuances of RF resistances and the complexities of analog circuit behaviors.

Metis for 2.5D/3D IC Packaging

Metis is an advanced EM solver that provides large-capacity simulation capabilities for 2.5D and 3D IC packaging. It enables comprehensive signal integrity (SI) and power integrity (PI) analysis, essential for modern multi-die package designs. This sophisticated tool aids in the simulation of complex IC designs, allowing designers to evaluate the interaction between different dielectrics and conductors within a multi-die package environment. Metis facilitates accurate modeling and optimization of electrical characteristics, ensuring designs are both reliable and high-performing. Engineers can leverage Metis to tackle the challenges of noise, cross-talk, and electromagnetic interference within dense packaging environments. Its ability to support detailed simulations helps in pushing the envelope of what is achievable in IC packaging, making it crucial for industries adopting advanced semiconductor technologies.